Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-1,000,2850 Semiconductor chip flexibly applied to various routing structures and semiconductor chip module using the same
A semiconductor chip may include a semiconductor substrate having a front surface and a rear surface which faces away from the front surface. The semiconductor...
US-1,000,2849 Semiconductor package structure and method for manufacturing the same
A method for manufacturing a semiconductor package structure includes: (a) disposing at least one semiconductor element on a conductive structure, wherein the...
US-1,000,2848 Test method for a redistribution layer
A conductive layer is formed on the first zone of a carrier. The redistribution layer is formed on the conductive layer on the first zone and the second zone of...
US-1,000,2847 OLED pixel unit, transparent display device, method for fabricating the same, display apparatus
An OLED pixel unit is disclosed, which comprises an opaque region and a transparent region which are arranged side by side, the opaque region comprises an...
US-1,000,2846 Method for remapping a packaged extracted die with 3D printed bond connections
A method is provided. The method includes removing an extracted die including an original ball bond from a previous packaged integrated circuit, bonding the...
US-1,000,2845 Lead-free soldering method and soldered article
In a soldering method for Ag-containing lead-free solders to be soldered to an Ag-containing member, void generation is prevented and solder wettability is...
US-1,000,2844 Bonded structures
A bonded structure can include a first element having a first conductive interface feature and a second element having a second conductive interface feature. An...
US-1,000,2843 Semiconductor substrate structure, semiconductor package and method of manufacturing the same
The present disclosure relates to a semiconductor substrate structure, semiconductor package and method of manufacturing the same. The semiconductor substrate...
US-1,000,2842 Method of producing a hybridized device including microelectronic components
A method of producing a hybridized device including two microelectronic components, including a first microelectronic component having conductive inserts on a...
US-1,000,2841 Semiconductor device
Electrode pads disposed on a first surface of a semiconductor element include a first pad located close to a corner and a second pad located apart from the...
US-1,000,2840 Semiconductor devices having discretely located passivation material, and associated systems and methods
Semiconductor devices having discretely located passivation material are disclosed herein. In one embodiment, a semiconductor device assembly can include a bond...
US-1,000,2839 Electronic structure, and electronic structure array
An electronic structure is provided with a redistribution structure and the following elements. A first supporting structure has a first opening and is disposed...
US-1,000,2838 Method and apparatus for back-biased switch transistors
An integrated radio frequency (RF) circuit structure may include an active device on a first surface of an isolation layer. The integrated RF circuit structure...
US-1,000,2837 Semiconductor device
A semiconductor device includes a metal member, a first semiconductor chip, a second semiconductor chip, a first solder and a second solder. A quantity of heat...
US-1,000,2836 Method of fabricating a semiconductor device and semiconductor product
A method of fabricating a semiconductor product including processing of a semiconductor wafer from a front surface including structures disposed in the...
US-1,000,2835 Structure for establishing interconnects in packages using thin interposers
A semiconductor device and a stacked pillar used to interconnect a first semiconductor die and a second semiconductor die are provided. The semiconductor device...
US-1,000,2834 Method and apparatus for protecting metal interconnect from halogen based precursors
A method and apparatus for forming an interconnect on a substrate is provided. A protective layer is formed on the substrate and in a via formed on the...
US-1,000,2833 Power and ground routing of integrated circuit devices with improved IR drop and chip performance
An integrated circuit chip includes a semiconductor substrate having thereon a plurality of inter-metal dielectric (IMD) layers and a plurality of first...
US-1,000,2832 Semiconductor integrated circuit device
Disclosed herein is a configuration for ensuring sufficient power supply ability and ESD protection capability for I/O cells in a semiconductor integrated...
US-1,000,2831 Selective and non-selective barrier layer wet removal
A method for manufacturing a semiconductor device includes forming a dielectric layer on a substrate, forming a plurality of openings in the dielectric layer,...
US-1,000,2830 Semiconductor device with multi-layer metallization
One or more embodiments are related to a semiconductor device, comprising: a metallization layer comprising a plurality of portions, each of the portions having...
US-1,000,2829 Semiconductor device and manufacturing method thereof
A semiconductor device is provided which comprises a semiconductive substrate and an interconnect on the substrate. The interconnect comprises a dielectric in...
US-1,000,2827 Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of...
Methods for identification and partial re-routing of selected areas (e.g., including critical areas) in a layout of an IC design and the resulting device are...
US-1,000,2826 Semiconductor device structure with conductive pillar and conductive line and method for forming the same
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes...
US-1,000,2825 Method of fabricating package structure with an embedded electronic component
The present invention provides a package structure with an embedded electronic component and a method of fabricating the package structure. The method includes:...
US-1,000,2824 Magnetic alignment for flip chip microelectronic devices
Incorporating at least one magnetic alignment structure on a microelectronic device and incorporating at least one alignment coil within a microelectronic...
US-1,000,2823 Packaging substrate and method of fabricating the same
A packaging substrate is provided, which includes: an insulating layer; a plurality of conductive bumps formed on the insulating layer, wherein each of the...
US-1,000,2822 Circuit boards and semiconductor packages including the same
A circuit board and a semiconductor packages therewith are disclosed. The circuit board may include a top surface, on which at least one semiconductor chip is...
US-1,000,2820 Through silicon via layout pattern
A semiconductor device comprises a substrate with a first side and a second side, wherein a plurality of active circuits are formed adjacent to the first side...
US-1,000,2819 Heat sink with integrated threaded lid
A method affixes a heat sink to a module lid. A module lid is mounted to a substrate by use of a lid adhesive. The module lid has a threaded exterior portion....
US-1,000,2818 Integrated electronic components and methods of formation thereof
Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and...
US-1,000,2817 Semiconductor device
A power module includes: a ceramic substrate that includes a principal surface and a back surface, and is provided with a plurality of metal wirings on the...
US-1,000,2816 Electronic device
A semiconductor integrated circuit, a radiation detection unit and a cooling unit are provided. Here, a radiation detection unit is provided near the...
US-1,000,2815 Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process
A wafer level chip package manufacturing process is provided. A wafer includes a plurality of first chips and a circuit layer disposed on the first chips,...
US-1,000,2814 Apparatuses and methods to enhance passivation and ILD reliability
Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on...
US-1,000,2812 Power semiconductor module having a pressure application body and arrangement therewith
A power semiconductor module having a pressure application body, a circuit carrier, which is embodied with a first conductor track, a power semiconductor...
US-1,000,2811 Electronic component package and method of manufacturing the same
An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via...
US-1,000,2810 On-chip combined hot carrier injection and bias temperature instability monitor
Methods and circuits for monitoring circuit degradation include measuring degradation in a plurality of on-chip test oscillators that vary according to a...
US-1,000,2809 Top contact resistance measurement in vertical FETs
A test device includes a diode junction layer having a first dopant conductivity region and a second dopant conductivity region formed within the diode junction...
US-1,000,2808 Semiconductor device manufacturing method and semiconductor device
To divide a semiconductor wafer by stealth dicing, a test pad in a cutting region and an alignment target are collectively arranged along one side in a width...
US-1,000,2807 Semiconductor device
A semiconductor device includes a semiconductor substrate on which plural gate electrodes are juxtaposed to each other, plural gate wirings formed on the...
US-1,000,2806 Metrology targets with filling elements that reduce inaccuracies and maintain contrast
The subject application relates to metrology targets with filling elements that reduce inaccuracies and maintain contrast. The present invention provides a...
US-1,000,2805 Processing methods and apparatus with temperature distribution control
Wafer treatment process and apparatus is provided with a wafer carrier arranged to hold wafers and to inject a fill gas into gaps between the wafers and the...
US-1,000,2804 Method of endpoint detection of plasma etching process using multivariate analysis
Described is a method for determining an endpoint of an etch process using optical emission spectroscopy (OES) data as an input. Optical emission spectroscopy...
US-1,000,2803 Flipped vertical field-effect-transistor
Various embodiments disclose a method for fabricating vertical transistors. In one embodiment, a structure is formed comprising at least a first substrate, an...
US-1,000,2802 Method for reducing core-to-core mismatches in SOC applications
Methods for reducing core-to-core mismatch are provided. The method includes measuring gate lengths of a representative pattern of each core in a first lot of...
US-1,000,2801 Device manufacturing method and device manufacturing apparatus
The device manufacturing method includes a length measuring step (S5) of, on the basis of an observation target image of an SEM image taken from a direction...
US-1,000,2800 Prevention of charging damage in full-depletion devices
Methods and systems method for checking a semiconductor device for compliance with a rule include determining one or more device type categories to which a...
US-1,000,2799 Ion implantation method and ion implantation apparatus performing the same
The present invention provides an improved ion implantation method and an ion implantation apparatus for performing the improved ion implantation method,...
US-1,000,2798 Structure and method for tensile and compressive strained silicon germanium with same germanium concentration...
A method of making a semiconductor device includes forming a first silicon germanium layer on a substrate, the first silicon germanium layer forming a portion...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.