Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-1,003,7994 Semiconductor devices having Fin field effect transistor (FinFET) structures and manufacturing and design...
Semiconductor devices and manufacturing and design methods thereof are disclosed. In one embodiment, a semiconductor device includes an active FinFET disposed...
US-1,003,7993 Method of making a FinFET device
A semiconductor device includes a semiconductor substrate; an isolation region over the semiconductor substrate; and two fin features over the semiconductor...
US-1,003,7992 Methods and apparatuses for optimizing power and functionality in transistors
A transistor device is provided. The transistor device includes a group of fins formed in a substrate, where the group of fins comprises at least one enabled...
US-1,003,7991 Systems and methods for fabricating FinFETs with different threshold voltages
Systems and methods are provided for fabricating semiconductor device structures on a substrate. A first fin structure is formed on a substrate. A second fin...
US-1,003,7990 Method of manufacturing interconnect layer and semiconductor device which includes interconnect layer
A semiconductor device includes an interconnect layer on an inter-layer dielectric (ILD) structure. The ILD structure includes: first contacts, extending...
US-1,003,7989 III-V lateral bipolar integration with silicon
A method of manufacturing a semiconductor structure is provided. Spacers on sidewalls of mandrels in a bipolar junction transistor (BJT) region, fins and...
US-1,003,7988 High voltage PNP using isolation for ESD and method for producing the same
A method of forming a HV lateral PNP BJT with a pulled back isolation structure and a polysilicon gate covering a part of the NW+HVNDDD base region and a part...
US-1,003,7987 Semiconductor structure of ESD protection device and method for manufacturing the same
Disclosed are a semiconductor structure of an ESD protection device with low capacitance and a method for manufacturing the same. The method for manufacturing a...
US-1,003,7986 ESD protection structure and method of fabrication thereof
An ESD protection structure formed within an isolation trench and comprising a first peripheral semiconductor region of a first doping type, a second...
US-1,003,7985 Compound micro-transfer-printed power transistor device
Embodiments of the present invention provide a compound power transistor device including a first semiconductor substrate including a first semiconductor...
US-1,003,7984 Display device
A display device including: a substrate including a display area and a non-display area; a first pad terminal and a second pad terminal disposed in the...
US-1,003,7983 Semiconductor device with modified current distribution
Semiconductor devices having modified current distribution and methods of forming the same are described herein. As an example, a memory die in contact with a...
US-1,003,7982 Photonic integrated circuit package
Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes...
US-1,003,7981 Integrated display system with multi-color light emitting diodes (LEDs)
A display system is disclosed. The display system comprises a light emitting diode (LED) device and a backplane (BP) device. The LED device comprises a...
US-1,003,7980 Fabricating method of a semiconductor light emitting device
A fabricating method of a semiconductor light emitting device includes disposing a plurality of non-conductive walls on a substrate. An alignment position is...
US-1,003,7979 Surface-mountable multi-chip component
A surface-mountable multi-chip component includes a carrier having a first connection element, a second connection element and third connection element that are...
US-1,003,7978 Semiconductor module and stack arrangement of semiconductor modules
A semiconductor module and a stack arrangement of semiconductor modules is proposed. The semiconductor module comprises an insulated gate bipolar transistor, a...
US-1,003,7977 Power electronics system
A power electronics assembly includes a case and an array of power stages disposed within the case. Each of the power stages includes a transistor-based...
US-1,003,7976 Scalable package architecture and associated techniques and configurations
Embodiments of the present disclosure describe scalable package architecture of an integrated circuit (IC) assembly and associated techniques and...
US-1,003,7975 Semiconductor device package and a method of manufacturing the same
A semiconductor device package including a first encapsulation layer, a redistribution layer disposed on the first encapsulation layer, a first die disposed on...
US-1,003,7974 Semiconductor device package and method of manufacturing the same
A semiconductor device package includes a package substrate, a first electronic device, a second electronic device and a first molding layer. The package...
US-1,003,7973 Method for manufacturing semiconductor package structure
A method for manufacturing a semiconductor package structure is provided. A semiconductor substrate comprising a conductive pad is provided, wherein the...
US-1,003,7972 Electronic module comprising fluid cooling channel and method of manufacturing the same
Various embodiments provide an electronic module comprising a interposer comprising a fluid channel formed in an electrically isolating material and an...
US-1,003,7971 Semiconductor device having plural memory chip
A semiconductor device includes a stacked plurality of memory chips. The memory chips each include a plurality of memory banks, a plurality of read/write buses...
US-1,003,7970 Multiple interconnections between die
Embodiments of a semiconductor packaged device and method of making thereof are provided, the device including a substrate; a first flip chip die mounted to a...
US-1,003,7969 Integrated circuit structure with active and passive devices in different tiers
An integrated circuit structure includes a two-tier die including a first tier and a second tier over and bonded to the first tier. The first tier includes a...
US-1,003,7968 Alignment systems and wafer bonding systems and methods
Alignment systems, and wafer bonding alignment systems and methods are disclosed. In some embodiments, an alignment system for a wafer bonding system includes...
US-1,003,7967 Injection molded solder bumping
Methods for depositing material on a chip include forming a mold layer on a substrate. The mold layer has one or more openings over respective contact areas on...
US-1,003,7966 Semiconductor device and manufacturing method therefor
The joint reliability in flip chip bonding of a semiconductor device is enhanced. Prior to flip chip bonding, flux 9 is applied to the solder bumps 5a for flip...
US-1,003,7965 Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum...
A semiconductor device includes a plurality of wire bonds formed on a surface of the semiconductor device by bonding each of a plurality of copper wires onto...
US-1,003,7964 Die-packaging component with retaining structure for package body thereof
A die-packaging component includes a substrate, a die, a jumper structure, a lead structure and a package body. The substrate has a base surface further...
US-1,003,7963 Package structure and method of forming the same
A package structure and method of forming the same includes: a first package including: a first die; a via adjacent the first die; a molding compound...
US-1,003,7962 Ball height control in bonding process
A package includes a first package component, a second package component over the first package component, and a solder region bonding the first package...
US-1,003,7961 Integrated fan-out package and method of fabricating the same
An integrated fan-out package including an integrated circuit, an insulating encapsulation, a plurality of conductive through vias, and a redistribution circuit...
US-1,003,7960 Connection structure and connecting method of circuit member
There is provided a connection structure of a circuit member including: a first circuit member having a first main surface provided with a first electrode; a...
US-1,003,7959 Semiconductor structure and manufacturing method thereof
A semiconductor structure includes a conductive bump, and a ferromagnetic member extended within the conductive bump, wherein a center of the conductive bump is...
US-1,003,7958 Fabrication of solder balls with injection molded solder
Wafers include multiple bulk redistribution layers. A terminal contact pad is on a surface of one of the bulk redistribution layers. A final redistribution...
US-1,003,7957 Semiconductor device and method of manufacturing thereof
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method of...
US-1,003,7956 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method...
The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal...
US-1,003,7955 Packaging devices and methods of manufacture thereof
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad...
US-1,003,7954 Chip with I/O pads on peripheries and method making the same
A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; a first metal layer, formed above the...
US-1,003,7953 Contact pad for semiconductor devices
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad...
US-1,003,7952 Integrated circuit, electronic device and method for transmitting data in electronic device
An integrated circuit is provided. The integrated circuit includes a control circuitry, a plurality of pins coupled to a plurality of conductive traces of a...
US-1,003,7951 Semiconductor package with antenna
A semiconductor package includes a radio frequency (RF) module, an antenna, an electromagnetic (EM) shield and a first mold body. The RF module having a bottom...
US-1,003,7950 Semiconductor device having features to prevent reverse engineering
It is desirable to design and manufacture electronic chips that are resistant to modern reverse engineering techniques. Disclosed is a method and device that...
US-1,003,7949 Semiconductor package and fabricating method thereof
A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor...
US-1,003,7948 Invisible compartment shielding
A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is...
US-1,003,7947 Electronic devices with yielding substrates
In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a...
US-1,003,7946 Package structure having embedded bonding film and manufacturing method thereof
A package structure having an embedded bonding film including a redistribution substrate, a bonding film and a core is provided. The redistribution substrate...
US-1,003,7945 Package structure and three dimensional package structure
A package structure is disclosed. The package structure includes at least a lead, for delivering at least a signal; at least a routing layer, connected to the...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.