Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-1,003,7944 Self-aligned contact process enabled by low temperature
Self-aligned contacts of a semiconductor device are fabricated by forming a metal gate structure on a portion of a semiconductor layer of a substrate. The metal...
US-1,003,7943 Metal gate transistor and fabrication method thereof
A method for fabricating a metal gate transistor includes forming a dummy gate structure surrounded by a first dielectric layer on a semiconductor substrate and...
US-1,003,7942 Low resistance contact structures for trench structures
An electrical device including at least one contact surface and an interlevel dielectric layer present atop the electrical device, wherein the interlevel...
US-1,003,7941 Integrated device package comprising photo sensitive fill between a substrate and a die
An integrated device package that includes a die, a substrate, a fill and a conductive interconnect. The die includes a pillar, where the pillar has a first...
US-1,003,7940 Reliable packaging and interconnect structures
Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an...
US-1,003,7939 Semiconductor apparatus
A semiconductor apparatus has a configuration in which multiple copper wiring layers and multiple insulating layers are alternately layered. A low-impedance...
US-1,003,7938 Semiconductor packages
A semiconductor package includes a first package and a second package stacked on the first package. The first package includes a redistribution substrate, a...
US-1,003,7937 Method for forming semiconductor package
A method of fabricating semiconductor packages includes providing an interposer layer having a first surface and a second surface opposite to the first surface,...
US-1,003,7936 Semiconductor package with coated bonding wires and fabrication method thereof
A semiconductor package includes a carrier substrate having a top surface, a semiconductor die mounted on the top surface, a plurality of bonding wires...
US-1,003,7935 Lead frame with dummy leads for burr mitigation during encapsulation
Embodiments of a lead frame for a packaged semiconductor device are provided, one embodiment including: a die pad; a first row of active lead fingers that are...
US-1,003,7934 Semiconductor chip package having contact pins at short side edges
A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact...
US-1,003,7933 Test socket assembly and related methods
A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more...
US-1,003,7932 Semiconductor device and method of manufacturing the same
In a resin sealing type semiconductor device, a semiconductor chip CP2 is mounted over a die pad DP having conductivity via a bonding member BD2 having...
US-1,003,7931 3D-microstrip branchline coupler
The disclosure is directed to semiconductor structures and, more particularly, to a three dimensional microstrip branchline coupler and methods of manufacture....
US-1,003,7930 Power semiconductor module and manufacturing method of power semiconductor module
An object of the present invention is to provide a power semiconductor module that can secure a satisfactory cooling without expanding the size of a case...
US-1,003,7929 Thermally enhanced semiconductor package having field effect transistors with back-gate feature
The present disclosure relates to a thermally enhanced semiconductor package having field effect transistors (FETs) with a back-gate feature. The thermally...
US-1,003,7928 Circuit board and electronic device
A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower...
US-1,003,7927 Semiconductor structure, testing and fabricating method thereof
A method of fabricating a semiconductor structure includes forming first and second features in a scribe region of a semiconductor substrate in which the first...
US-1,003,7926 Apparatus and methods for through substrate via test
A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side...
US-1,003,7925 Removable sacrificial connections for semiconductor devices
Methods of fabricating semiconductor devices and Radio Frequency (RF) components are provided. The method includes providing a circuit layout on a semiconductor...
US-1,003,7924 Fin-FET device and fabrication method thereof
A method for fabricating a Fin-FET device includes forming fin structures with each having a gate structure on the top in both P-type regions and N-type...
US-1,003,7923 Forming transistor by selectively growing gate spacer
A method includes forming a gate dielectric layer on a semiconductor fin, and forming a gate electrode over the gate dielectric layer. The gate electrode...
US-1,003,7922 Co-integration of tensile silicon and compressive silicon germanium
Integrated circuits are disclosed in which the strain properties of adjacent pFETs and nFETs are independently adjustable. The pFETs include ...
US-1,003,7921 Structure and formation method of fin-like field effect transistor
A structure and a formation method of a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a fin structure over...
US-1,003,7920 Method for semiconductor device fabrication
A method of forming a semiconductor device includes receiving a substrate with a gate structure and forming a spacer layer over the substrate and the gate...
US-1,003,7919 Integrated single-gated vertical field effect transistor (VFET) and independent double-gated VFET
A structure and method of making a semiconductor device includes a single-gated vertical field effect transistor (VFET), that has a first fin on a first bottom...
US-1,003,7918 Contact structure and method of fabricating the same
A method includes forming a first transistor and a second transistor over a substrate, wherein the first transistor and the second transistor share a...
US-1,003,7917 Structure and formation method of semiconductor device structure
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a fin structure over a...
US-1,003,7916 Semiconductor fins for finFET devices and sidewall image transfer (SIT) processes for manufacturing the same
A method of forming a semiconductor structure includes providing a semiconductor substrate, forming at least one precursor semiconductor fin from the...
US-1,003,7915 Fabricating method of a semiconductor structure with an epitaxial layer
A fabricating method of a semiconductor structure includes providing a substrate divided into a dense region and an isolated region, wherein a first gate...
US-1,003,7914 Semiconductor transistor device and fabrication method thereof
A semiconductor transistor device includes a substrate having an active area and a trench isolation region surrounding the active area, a gate oxide layer, a...
US-1,003,7913 Interconnect structures with enhanced electromigration resistance
Interconnect structures are provided that include an intermetallic compound as either a cap or liner material. The intermetallic compound is a thermal reaction...
US-1,003,7912 Semiconductor device and method of manufacturing the same
In a method of forming a semiconductor device including a fin field effect transistor (FinFET), a first sacrificial layer is formed over a source/drain...
US-1,003,7911 Device layer transfer with a preserved handle wafer section
Assemblies including a device layer of a silicon-on-insulator (SOI) substrate and a replacement substrate replacing a handle wafer of the SOI substrate, and...
US-1,003,7910 Wafer holder and method for manufacturing the same
A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a...
US-1,003,7909 Plasma processing apparatus
In a plasma processing apparatus, a connector section with the film-like electrode of a sintered plate of a sample stage to which high-frequency power is...
US-1,003,7908 Overhead traveling vehicle system and transfer control method for overhead traveling vehicle system
An overhead traveling vehicle includes a hoist and a first sensor that monitors obstacles below, and a local carriage includes a hoist and travels along the...
US-1,003,7907 Frame unit transfer system
Disclosed herein is a frame unit transfer system for transferring a frame unit formed by supporting a workpiece through an adhesive tape to an annular frame,...
US-1,003,7906 Systems and methods for annealing semiconductor structures
Systems and methods are provided for annealing a semiconductor structure. In one embodiment, the method includes providing an energy-converting structure...
US-1,003,7905 UV and reducing treatment for K recovery and surface clean in semiconductor processing
Treatment of carbon-containing low-k dielectric with UV radiation and a reducing agent enables process-induced damage repair. Also, treatment with a reducing...
US-1,003,7903 Bonding device, bonding method and pressure applying unit
Provided is a bonding device for bonding a substrate and an electronic part of an assembled body which is formed by mounting the electronic part on the...
US-1,003,7902 Substrate processing device and substrate processing method
A substrate processing device includes a holding member for holding a substrate, and an opposed member having a body portion and an extended portion extending...
US-1,003,7901 Substrate liquid treatment apparatus, method of cleaning substrate liquid treatment apparatus and...
A substrate liquid treatment apparatus includes: at least one processing unit that processes a substrate with a treatment liquid; a storage tank that stores the...
US-1,003,7900 Underfill stop using via bars in semiconductor packages
A device is disclosed. The device includes a baseboard including a first set of metallic contact pads, a semiconductor integrated chip (IC) package including a...
US-1,003,7899 Semiconductor device with high thermal conductivity substrate and process for making the same
The present disclosure relates to a process of forming a high thermal conductivity substrate for an Aluminum/Gallium/Indium (III)-Nitride semiconductor device....
US-1,003,7898 Water soluble flux with modified viscosity
A one-step water soluble (WS) flux process may reduce residue staining and increase yields for bond grid array (BGA) packages. In one example, the WS flux may...
US-1,003,7897 Inter-fan-out wafer level packaging with coaxial TIV for 3D IC low-noise packaging
A semiconductor package includes a first semiconductor element, an insulating layer, and a second semiconductor element. The first semiconductor element...
US-1,003,7896 Electro-assisted transfer and fabrication of wire arrays
A fabrication method includes: (1) forming a wire array on a fabrication substrate; (2) forming a porous layer within a portion of the fabrication substrate...
US-1,003,7895 Structures, methods and applications for electrical pulse anneal processes
Structures and methods are provided for nanosecond electrical pulse anneal processes. The method of forming an electrostatic discharge (ESD) N+/P+ structure...
US-1,003,7894 Polishing liquid for metal and polishing method
The present invention relates to a metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising, component A: a...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.