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Patent # Description
US-1,004,3701 Substrate removal from a carrier
Methods and apparatuses are provided where a parting agent is applied to at least one portion of a substrate. The at least one portion of the substrate is...
US-1,004,3700 Method of fabricating diamond-semiconductor composite substrates
A method of fabricating a semiconductor-on-diamond composite substrate, the method comprising: (i) starting with a native semiconductor wafer comprising a...
US-1,004,3699 High capacity overhead transport (OHT) rail system with multiple levels
An overhead transport (OHT) system with multiple levels of rails for the transport of semiconductor workpieces is provided. A first vehicle is configured to...
US-1,004,3698 Transport system and transport method
In a transport system, a local track is disposed so as to be below an overhead travelling vehicle track in parallel or substantially in parallel therewith, and...
US-1,004,3697 Substrate processing apparatus and article manufacturing method
A substrate processing apparatus including a plurality of processing devices each of which processes a substrate is provided. The apparatus comprises a...
US-1,004,3696 Wafer container with tubular environmental control components
A wafer container utilizes a rigid polymer tubular tower with slots and a "getter" therein for absorbing and filtering moisture and vapors within the wafer...
US-1,004,3695 Apparatus for carrying and shielding wafers
Apparatus for carrying and shielding wafers includes a wafer container, a plurality of wafer cassettes disposed in the wafer container, and an engaging lock...
US-1,004,3694 Inspection device and substrate processing apparatus
Surface image data of a non-defective sample substrate is acquired, and surface image data of a substrate to be inspected is acquired. Differences between...
US-1,004,3693 Method and apparatus for handling substrates in a processing system having a buffer chamber
Implementations described herein generally relate to a method and apparatus for processing substrates in a processing system. The method includes identifying,...
US-1,004,3692 Substrate processing apparatus, substrate transport method, and computer-readable recording medium with stored...
A substrate processing apparatus includes a substrate processing device, a substrate accommodation-status detection device, a substrate-transport device...
US-1,004,3691 Control wafer making device
A control wafer making device, a method of measuring an epitaxy thickness in a control wafer, and a method for monitoring a control wafer are provided. In...
US-1,004,3690 Fault detection using showerhead voltage variation
A method includes providing radio frequency (RF) power from an RF power supply to a showerhead of a plasma processing system running a process operation on a...
US-1,004,3689 Chamber apparatus and processing system
A chamber apparatus according to the present invention including a chamber main body including an opening portion in an upper surface; a door that opens/closes...
US-1,004,3688 Method for mount tape die release system for thin die ejection
An apparatus, system, and a method of using the apparatus or system that includes a bladder positioned between tape and an adhesive layer configured to...
US-1,004,3687 Bumped electrode arrays for microassemblers
An apparatus including a bumped electrode array and a method of fabricating a bumped electrode array is disclosed. The method includes providing a substrate for...
US-1,004,3686 Apparatus for treating surfaces of wafer-shaped articles
An apparatus for processing wafer-shaped articles, comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the...
US-1,004,3684 Self-limiting atomic thermal etching systems and methods
Systems and methods of etching a semiconductor substrate may include flowing an oxygen-containing precursor into a substrate processing region of a...
US-1,004,3683 Plasma system, chuck and method of making a semiconductor device
A chuck, a system including a chuck and a method for making a semiconductor device are disclosed. In one embodiment the chuck includes a first conductive region...
US-1,004,3682 Unit for supplying treatment liquid and apparatus for treating substrate
Disclosed is an apparatus for treating a substrate. The apparatus includes a support unit that supports the substrate, and a treatment liquid supply unit that...
US-1,004,3681 Fluid supply system, wafer processing system, and method of supplying fluid to wafer processing equipment
A fluid supply system includes a pressure tank configured to contain a pressurized gas and a fluid, a delivery point configured to be connected to a point of...
US-1,004,3680 Method for manufacturing semiconductor device
It is an object to provide a method for manufacturing a semiconductor device which can reduce degradation in package strength and a manufacturing cost, and...
US-1,004,3679 Method of fabricating array substrate
A method of fabricating an array substrate including forming an oxide semiconductor layer on a substrate; sequentially forming a gate insulating layer and a...
US-1,004,3678 Metal film polishing slurry composition, and method for reducing scratches generated when polishing metal film...
The present invention relates to a slurry composition for reducing scratches generated when polishing the metal film in a manufacturing process of a...
US-1,004,3677 Method for manufacturing filling planarization film and method for manufacturing electronic device
A method for manufacturing a filling planarization film, the method including: a first coating step of applying a first coating liquid, containing a polyamine...
US-1,004,3676 Local semiconductor wafer thinning
A local thinning process is employed on the backside of a semiconductor substrate such as a wafer in order to improve the thermal performance of the electronic...
US-1,004,3675 Semiconductor device and method for fabricating the same
A method for fabricating semiconductor device includes the steps of: providing a substrate; forming a fin-shaped structure on the substrate; performing a first...
US-1,004,3674 Germanium etching systems and methods
Exemplary methods for etching a germanium-containing material may include forming a plasma of a fluorine-containing precursor in a remote plasma region of a...
US-1,004,3673 Final polishing method of silicon wafer and silicon wafer
A final polishing method using a polishing agent that contains colloidal silica, ammonia, and hydroxyethyl cellulose in which the colloidal silica has a primary...
US-1,004,3672 Selective self-aligned patterning of silicon germanium, germanium and type III/V materials using a...
A method for patterning a substrate including multiple layers using a sulfur-based mask includes providing a substrate including a first layer and a second...
US-1,004,3671 Transistor and fabrication method thereof
A junction-less transistor structure and fabrication method thereof are provided. The method includes providing a semiconductor substrate; and forming an...
US-1,004,3670 Systems and methods for low resistivity physical vapor deposition of a tungsten film
Systems and methods for sputtering a layer of refractory metal layer onto a barrier layer disposed on a substrate are disclosed herein. In one or more...
US-1,004,3669 Method for fabricating metal gate structure
A method for fabricating a metal gate structure includes following steps. A substrate is provided and followed by forming a high-K dielectric layer on the...
US-1,004,3668 Selective dry etch for directed self assembly of block copolymers
Methods for preparing a patterned directed self-assembly layer generally include providing a substrate having a block copolymer layer including a first...
US-1,004,3667 Integrated method for wafer outgassing reduction
Implementations disclosed herein relate to methods for controlling substrate outgassing. In one implementation, the method includes removing oxides from an...
US-1,004,3666 Method for inter-chamber process
Embodiments described herein generally relate to a substrate processing system, such as an etch processing system. In one embodiment, a method of processing a...
US-1,004,3665 Formation method of semiconductor device structure with semiconductor nanowire
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a substrate, a first source...
US-1,004,3664 Multilayer structure, method for manufacturing same, semiconductor device, and crystalline film
A multilayer structure with excellent crystallinity and a semiconductor device of the multilayer structure with good mobility are provided. A multilayer...
US-1,004,3663 Enhanced defect reduction for heteroepitaxy by seed shape engineering
A heteroepitaxially grown structure includes a substrate and a mask including a high aspect ratio trench formed on the substrate. A cavity is formed in the...
US-1,004,3662 Method of forming semiconductor substrate
A method of forming a semiconductor substrate including forming a base layer of a Group 13-15 material on a growth substrate during a growth process, forming a...
US-1,004,3661 Method for protecting layer by forming hydrocarbon-based extremely thin film
A method for protecting a layer includes: providing a substrate having a target layer; depositing a protective layer on the target layer, which protective layer...
US-1,004,3660 Semiconductor device or display device including the same
To provide a novel method for manufacturing a semiconductor device. To provide a method for manufacturing a highly reliable semiconductor device at relatively...
US-1,004,3659 Semiconductor device or display device including the same
A method for manufacturing a novel semiconductor device is provided. The method includes a first step of forming a first oxide semiconductor film over a...
US-1,004,3658 Precursors for silicon dioxide gap fill
A full fill trench structure is described, including a microelectronic device substrate having a high aspect ratio trench therein and filled with silicon...
US-1,004,3657 Plasma assisted atomic layer deposition metal oxide for patterning applications
The embodiments herein relate to methods and apparatus for depositing an encapsulation layer over memory stacks in MRAM and PCRAM applications. The...
US-1,004,3656 Selective growth of silicon oxide or silicon nitride on silicon surfaces in the presence of silicon oxide
Methods and apparatuses for selectively depositing silicon-containing dielectric or metal-containing dielectric material on silicon or metal surfaces selective...
US-1,004,3655 Plasma activated conformal dielectric film deposition
Methods of depositing a film on a substrate surface include surface mediated reactions in which a film is grown over one or more cycles of reactant adsorption...
US-1,004,3654 Method for rinsing compound semiconductor, solution for rinsing compound semiconductor containing gallium as...
A method for rinsing a compound semiconductor, the method including a step of rinsing a compound semiconductor at a temperature of 80 degrees centigrade or...
US-1,004,3653 Maranagoni dry with low spin speed for charging release
A method of cleaning and drying a semiconductor wafer including inserting a semiconductor wafer into a chamber of a cleaning tool, spinning the semiconductor...
US-1,004,3652 Substrate cleaning method, substrate cleaning system, and memory medium
A method for cleaning a substrate, includes supplying to a substrate having a hydrophilic surface a film-forming processing liquid which includes a volatile...
US-1,004,3651 Semiconductor cleaner systems and methods
In an embodiment, the present invention discloses a EUV cleaner system and process for cleaning a EUV carrier. The euv cleaner system comprises separate dirty...
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