Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-1,004,9949 In-situ packaging decapsulation feature for electrical fault localization
An IR camera is used to image an IC to identify hot spots. The objective of the IR camera is removed and laser optics are inserted into the optical axis of the...
US-1,004,9948 Power switching system for ESC with array of thermal control elements
A semiconductor substrate support for supporting a semiconductor substrate in a plasma processing chamber includes a heater array comprising thermal control...
US-1,004,9947 Method of manufacturing a substrate
A method of manufacturing a substrate is disclosed. The method comprises: providing a first semiconductor substrate, which includes an at least partially...
US-1,004,9946 Vertical CMOS structure and method
A method for forming stacked, complementary transistors is disclosed. Selective deposition techniques are used to form a column having a lower portion that...
US-1,004,9945 Forming a CMOS with dual strained channels
The present invention relates generally to a semiconductor device, and more particularly, to a structure and method of forming a compressive strained layer and...
US-1,004,9944 Method of manufacturing selective nanostructures into finFET process flow
A method for integrating nanostructures in finFET processing and a related device are provided. Embodiments include forming fins in a Si substrate in first and...
US-1,004,9943 Methods of manufacturing a semiconductor device
A method of manufacturing a semiconductor device includes forming a first gate structure on a substrate, the first gate structure including a gate insulation...
US-1,004,9942 Asymmetric semiconductor device and method of forming same
An aspect of the disclosure provides for an asymmetric semiconductor device. The asymmetric semiconductor device may comprise: a substrate; and a fin-shaped...
US-1,004,9941 Semiconductor isolation structure with air gaps in deep trenches
A device includes a semiconductor substrate, a contact plug over the semiconductor substrate, and an Inter-Layer Dielectric (ILD) layer over the semiconductor...
US-1,004,9940 Structure and method for metal gates with roughened barrier layer
A method of forming a semiconductor device includes receiving a structure having a substrate, a gate trench over the substrate, and a dielectric layer over the...
US-1,004,9939 Semiconductor device and a method for fabricating the same
In a method of manufacturing a semiconductor device, an isolation region is formed in a substrate, such that the isolation region surrounds an active region of...
US-1,004,9938 Semiconductor devices, FinFET devices, and manufacturing methods thereof
Semiconductor devices, fin field effect transistor (FinFET) devices, and methods of manufacturing semiconductor devices are disclosed. In some embodiments, a...
US-1,004,9936 Semiconductor device having merged epitaxial features with Arc-like bottom surface and method of making the same
A semiconductor device and method of forming the same is disclosed. The semiconductor device includes a substrate, two semiconductor fins over the substrate,...
US-1,004,9935 Integrated circuit package having pin up interconnect
An integrated circuit package and manufacturing method thereof are described. The integrated circuit package includes pin up conductive plating to form an...
US-1,004,9934 Wafer processing method
A wafer processing method divides a wafer into individual device chips along division lines. The method includes attaching an adhesive tape to the front side of...
US-1,004,9933 Element chip manufacturing method
An element chip manufacturing method includes a preparation process of preparing a substrate which includes a first surface provided with a bump and a second...
US-1,004,9932 Method of manufacturing of a sidewall opening of an interconnect of a semiconductor device
A semiconductor device includes a substrate having a top surface. A semiconductor circuit defines a circuit area on the top surface of the substrate. An...
US-1,004,9931 Method of manufacturing a semiconductor device including through silicon plugs
A method of making a semiconductor device is provided including forming a first opening and a second opening in a first surface of a substrate. A conductive...
US-1,004,9930 Memory device and operation method thereof
A semiconductor device and a method for fabricating the semiconductor device are provided. In the method for fabricating the semiconductor device, at first, a...
US-1,004,9929 Method of making semiconductor structure having contact plug
The present invention provides a method of forming a semiconductor structure including a substrate, a transistor, a first ILD layer, a second ILD layer, a first...
US-1,004,9928 Embedded 3D interposer structure
A device includes an interposer, which includes a substrate; and at least one dielectric layer over the substrate. A plurality of through-substrate vias (TSVs)...
US-1,004,9927 Seam-healing method upon supra-atmospheric process in diffusion promoting ambient
Aspects of the disclosure include methods of treating a substrate to remove one or more of voids, seams, and grain boundaries from interconnects formed on the...
US-1,004,9926 Metal lines having etch-bias independent height
A dielectric material stack including at least a via level dielectric material layer, at least one patterned etch stop dielectric material portion, a line level...
US-1,004,9925 Metal-semiconductor contact structure with doped interlayer
Disclosed herein is a method of forming a metal-to-semiconductor contact with a doped metal oxide interlayer. An insulating layer is formed on a top surface of...
US-1,004,9924 Selective formation of metallic films on metallic surfaces
Metallic layers can be selectively deposited on surfaces of a substrate relative to a second surface of the substrate. In preferred embodiments, the metallic...
US-1,004,9922 Method of forming trenches
A method of forming a semiconductor device includes forming a material layer over a substrate and forming a first trench in the material layer, forming a...
US-1,004,9921 Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from...
Implementations of the methods and apparatus disclosed herein relate to pore sealing of porous dielectric films using flowable dielectric material. The methods...
US-1,004,9920 Reduced tip-to-tip and via pitch at line end
A semiconductor structure and methods of forming the semiconductor structure forming a single damascene line formed of a conductive material in a dielectric...
US-1,004,9919 Semiconductor device including a target integrated circuit pattern
A method of forming a target pattern includes forming a plurality of lines over a substrate with a first mask and forming a first spacer layer over the...
US-1,004,9918 Directional patterning methods
Directional patterning methods are disclosed herein. An exemplary method includes performing a lithography process to form a pattered hard mask layer over a...
US-1,004,9917 FDSOI channel control by implanted high-K buried oxide
Methods of locally changing the BOX layer of a MOSFET device to a high-k layer to provide different Vts with one backside voltage and the resulting device are...
US-1,004,9916 Method of manufacturing a germanium-on-insulator substrate
A method of manufacturing a germanium-on-insulator substrate is disclosed. The method comprises: providing (102) a first semiconductor substrate, and a second...
US-1,004,9915 Three dimensional integrated circuit
A stacked semiconductor device is formed by implanting ions through dielectric and conductive structures of a first substrate to define a cleave plane in the...
US-1,004,9914 Method for thinning substrates
According to various embodiments, a method may include: providing a substrate having a first side and a second side opposite the first side; forming a buried...
US-1,004,9913 Methods for SiO.sub.2 filling of fine recessed features and selective SiO.sub.2 deposition on catalytic surfaces
Methods for void-free SiO.sub.2 filling of fine recessed features and selective SiO.sub.2 deposition on catalytic surfaces are described. According to one...
US-1,004,9912 Method of manufacturing a semiconductor device having a vertical edge termination structure
A method of manufacturing a semiconductor device includes forming a frame trench extending from a first surface into a base substrate, forming, in the frame...
US-1,004,9911 Temporally pulsed and kinetically modulated CVD dielectrics for gapfill applications
A method for performing temporally pulsed chemical vapor deposition (CVD) is provided, including: providing a first reactant configured to adsorb on exposed...
US-1,004,9910 Manufacturing method of semiconductor device and semiconductor manufacturing apparatus using a conveying robot...
An object of the present invention is to prevent a semiconductor substrate from being damaged when the substrate is conveyed by a conveying robot provided in a...
US-1,004,9909 Wafer handler and methods of manufacture
A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed...
US-1,004,9908 Methods and apparatus for electrostatic chuck repair and refurbishment
In one embodiment of the invention, a substrate support assembly comprises an electrostatic chuck having an electrode embedded therein and having an aperture...
US-1,004,9907 Automated module for assembly lines and method to actuate and control thereof
An automated module for assembly lines to assemble electronic devices includes a plurality of cells. Each cell includes a support structure, a control unit and...
US-1,004,9906 Substrate processing apparatus
Provided is a substrate processing apparatus, which comprises a processing chamber, a substrate sensing assembly, a rotation shaft and a driving assembly. A...
US-1,004,9905 Substrate heat treatment apparatus, substrate heat treatment method, storage medium and...
A substrate heat treatment apparatus includes: a placement unit on which a substrate is placed; a heat treatment unit for heating or cooling the substrate on...
US-1,004,9904 Method and system for moving a substrate
A method and a system for moving a substrate, the system includes a chamber, a chuck, a movement system that is positioned outside the chamber, a controller, an...
US-1,004,9903 Method of manufacturing a high definition heater system
Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric...
US-1,004,9902 Substrate stack holder, container and method for parting a substrate stack
A substrate stack holder, a container comprising a plurality of substrate stack holders, and a method for parting a substrate stack. The substrate stack holder...
US-1,004,9901 Apparatus and method for wafer level bonding
A method includes placing a first wafer onto a surface of a first wafer chuck, the first wafer chuck including multiple first profile control zones separated by...
US-1,004,9900 Substrate treatment method
A substrate treatment method and apparatus including a change controlling unit which changes at least one of a protection liquid application position relative...
US-1,004,9899 Substrate cleaning apparatus
A substrate cleaning apparatus for removing particles adhered to a substrate includes a cleaning chamber for cleaning a substrate under a vacuum atmosphere, a...
US-1,004,9898 Semiconductor device packages, packaging methods, and packaged semiconductor devices
Semiconductor device packages, packaging methods, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.