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Patent # Description
US-1,004,9897 Extrusion-resistant solder interconnect structures and methods of forming
Various embodiments include methods of forming interconnect structures, and the structures formed by such methods. In one embodiment, an interconnect structure...
US-1,004,9896 Lid attach optimization to limit electronic package warpage
An electronic package includes a carrier and a semiconductor chip. In a first aspect a lid is attached to the chip and subsequently the gap between the lid and...
US-1,004,9895 Thermal block assemblies and instruments providing low thermal non-uniformity for rapid thermal cycling
The present teachings disclose various embodiments of a thermal block assembly having low thermal non-uniformity throughout the thermal block assembly....
US-1,004,9894 Package structures and methods for forming the same
A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally...
US-1,004,9893 Semiconductor device with a conductive post
A semiconductor package comprises a substrate, a pad, a first isolation layer, an interconnection layer, and a conductive post. The substrate has a first...
US-1,004,9892 Method for processing photoresist materials and structures
Techniques herein include methods of processing photoresist patterns and photoresist materials for successful use in multi-patterning operations. Techniques...
US-1,004,9891 Selective in situ cobalt residue removal
Exemplary methods for removing cobalt material may include flowing a chlorine-containing precursor into a processing region of a semiconductor processing...
US-1,004,9890 Semiconductor structure and method of manufacturing the same
The present disclosure provides a semiconductor structure, comprising a substrate, dielectric layers and conductive layers. A first dielectric layer is disposed...
US-1,004,9889 Method of fabricating package structures
Some embodiments contemplate methods for forming a package structure and a package structure formed thereby. An embodiment method includes depositing a...
US-1,004,9888 System and method for regenerating phosphoric acid solution, and apparatus and method for treating substrate
Disclosed is a method of regenerating a phosphoric acid solution from a treatment liquid including silicon (Si), hydrogen fluoride (HF), and phosphoric acid,...
US-1,004,9887 Method of planarizing substrate surface
A method of planarizing a substrate surface is disclosed. A substrate having a major surface of a material layer is provided. The major surface of the material...
US-1,004,9886 System and method for damage reduction in light-assisted processes
A method embodiment for forming a semiconductor device includes providing a dielectric layer having a damaged surface and repairing the damaged surface of the...
US-1,004,9885 Method for patterning a plurality of features for fin-like field-effect transistor (FinFET) devices
A method for patterning fins for FinFET devices are disclosed. The method includes forming elongated protrusions on a semiconductor substrate and forming a mask...
US-1,004,9884 Anodic etching of substrates
A bi-directional bipolar junction transistor (BJT) structure, comprising: a base region of a first conductivity type, wherein said base region constitutes a...
US-1,004,9883 MRAM dry etching residue removal composition, method of producing magnetoresistive random access memory, and...
An object is to provide an MRAM dry etching residue removal composition capable of removing dry etching residues while suppressing damage to a substrate...
US-1,004,9882 Method for fabricating semiconductor device including forming a dielectric layer on a structure having a height...
A method for fabricating a semiconductor device includes forming a structure with a height difference on a substrate and forming a dielectric layer structure on...
US-1,004,9881 Method and apparatus for selective nitridation process
Embodiments of the invention provide an improved apparatus and methods for nitridation of stacks of materials. In one embodiment, a remote plasma system...
US-1,004,9880 Semiconductor device and method of manufacturing semiconductor device
A method of manufacturing a semiconductor device, where the device includes a donor layer that is obtained by changing a crystal defect formed in a...
US-1,004,9879 Self aligned silicon carbide contact formation using protective layer
A silicon-carbide substrate that includes: a doped silicon-carbide contact region directly adjoining a main surface of the substrate, and a dielectric layer...
US-1,004,9878 Self-aligned patterning process
Embodiments of the present disclosure are a method of forming a semiconductor device and methods of patterning a semiconductor device. An embodiment is a method...
US-1,004,9877 Patterning method
A method for forming fine patterns is described. A bottom layer, a hard mask layer, a buffer mask layer and a mask layer are sequentially formed on a substrate....
US-1,004,9876 Removal of trilayer resist without damage to underlying structure
A method for semiconductor processing includes forming a trilayer resist structure having a middle layer disposed between a top layer and a bottom layer. The...
US-1,004,9875 Trim method for patterning during various stages of an integration scheme
Provided is a method for critical dimension (CD) trimming of a structure pattern in a substrate, the method comprising: providing a substrate in a process...
US-1,004,9874 Self-assembled nanostructures including metal oxides and semiconductor structures comprised thereof
A self-assembled nanostructure comprises first domains and second domains. The first domains comprise a first block of a block copolymer material and an...
US-1,004,9873 Preparation methods of low temperature poly-silicon thin film and transistor and laser crystallization apparatus
The invention provides a preparation method of a low temperature poly-silicon thin film, a preparation method of a low temperature poly-silicon thin film...
US-1,004,9872 Method for growing epitaxies of a chemical compound semiconductor
A method includes providing a substrate, forming a prelayer over a substrate, forming a barrier layer over the prelayer, and forming a channel layer over the...
US-1,004,9871 Anisotropic deposition in nanoscale wires
The present invention generally relates to nanoscale wires, including anisotropic deposition in nanoscale wires. In one set of embodiments, material may be...
US-1,004,9870 Method of manufacturing semiconductor device including silicon nitride layer for inhibiting excessive oxidation...
To inhibit excessive oxidation and increase oxidation resistance of a polysilicon film on a substrate during recovery process, an oxygen-containing silicon...
US-1,004,9869 Composite dielectric interface layers for interconnect structures
Dielectric composite films characterized by a dielectric constant (k) of less than about 7 and having a density of at least about 2.5 g/cm.sup.3 are deposited...
US-1,004,9868 Apparatus for detecting constituents in a sample and method of using the same
An apparatus for detecting constituents in a sample includes first and second drift tubes defining first and second drift regions, and a controllable electric...
US-1,004,9867 Ion trap mass spectrometer
An apparatus 41 and operation method are provided for an electrostatic trap mass spectrometer with measuring frequency of multiple isochronous ionic...
US-1,004,9866 In-source chemical modification of non polar analytes using atmospheric pressure chemical ionisation source
A method for analyzing an aliphatic compound by mass spectrometry which comprises: (i) ionizing an aliphatic compound in the presence of a heterocyclic...
US-1,004,9865 Intelligently controlled spectrometer methods and apparatus
The present invention relates to improving the ability of a hyphenated instrument to analyze a sample benefiting from having the first instrument's analysis of...
US-1,004,9864 Metallic glow discharge diode and triode devices with large cold cathode as efficient charger generator--a...
The invention describes a metal container that comprises a cathode containing an insulated anode with gases at pressures less than a fraction (0.1-0.9) of a...
US-1,004,9863 Sputtering target with backside cooling grooves
Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a...
US-1,004,9862 Chamber with vertical support stem for symmetric conductance and RF delivery
A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for...
US-1,004,9861 Inductively coupled RF plasma source with magnetic confinement and Faraday shielding
Disclosed is an inductively coupled RF plasma source that provides both magnetic confinement to reduce plasma losses and Faraday shielding to suppress parasitic...
US-1,004,9860 Substrate processing apparatus
An apparatus includes a row of substrate transfer devices 3 which can deliver a wafer W within a transfer chamber; and rows of process modules PM, arranged at...
US-1,004,9859 Plasma generating units for processing a substrate
Apparatus and method for plasma-based processing well suited for deposition, etching, or treatment of semiconductor, conductor or insulating films. Plasma...
US-1,004,9858 System and method for protection of vacuum seals in plasma processing systems
Systems and methods for protecting vacuum seals in a plasma processing system are provided. The processing system can include a vacuum chamber defining a...
US-1,004,9857 Adaptive periodic waveform controller
A repeating setpoint generator module selectively varies a setpoint for an output parameter according to a predetermined pattern that repeats during successive...
US-1,004,9856 High temperature intermittent ion implantation
A method includes providing a semiconductor substrate, and performing an ion implantation process to a surface of the substrate. The ion implantation process...
US-1,004,9855 Detecting charged particles
The system described herein detects charged particles which, for example, are generated by interaction of a charged particle beam with an object to be analyzed...
US-1,004,9854 Charged particle beam lens apparatus, charged particle beam column, and charged particle beam exposure apparatus
Provided is a charged particle beam lens apparatus having a small size and high resolution, and a charged particle beam column and a charged particle beam...
US-1,004,9853 Method and apparatus for an imaging system of biological material
The present invention provides apparatus for an imaging system comprising a multitude of chemical emitting elements upon a substrate. In some embodiments the...
US-1,004,9852 Assessment and calibration of a high energy beam
A high energy beam verification, calibration, and profiling system includes a conductive base plate, supports extending from the base plate, a plurality of...
US-1,004,9851 Data processing of electron beam lithography system
A system includes a digital pattern generator (DPG) having a plurality of pixels that are dynamically and individually controllable; a switching device that is...
US-1,004,9850 X-ray apparatus with deflectable electron beam
An x-ray apparatus (1), has an electron beam source (2), a target (4), onto which the electron beam (3) is directed to form a focal spot (5; 5a, 5b) on the...
US-1,004,9849 Magnetic shielding of an x-ray emitter
An x-ray emitter includes a housing. In an embodiment, the method for assembling the housing includes producing a housing of the x-ray emitter and assembling...
US-1,004,9848 Photocathode and method for assembly
Technologies are described for methods for fabricating a film component. The methods may comprise sputtering a first film onto a substrate. The first film may...
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