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Patent # Description
US-1,012,3470 Electronic component mounting system and electronic component mounting method
An electronic component mounting system includes: a printing apparatus; a plurality of electronic component mounting apparatuses; and a mounting information...
US-1,012,3469 Substrate process system, process procedure optimization program, and program for determining number of process...
A substrate process system which includes a plurality of arranged process machines, and in which a circuit substrate is transported from an upstream process...
US-1,012,3468 Electronic component supply apparatus
An electronic component supply apparatus that transports a component supply tape which has accommodation sections and sprocket holes and which accommodates an...
US-1,012,3467 Magnetic field shielding sheet for a wireless charger, method for manufacturing same, and receiving apparatus...
Provided are a magnetic field shield sheet for a wireless charger, a method of manufacturing the sheet, and a receiver for the wireless charger by using the...
US-1,012,3466 Electrically and thermally conductive planar interface gasket with deformable fingers
An electrically- and thermally-conductive gasket includes a planar base and a series of fingers bent out of the plane of the base. The base and the fingers are...
US-1,012,3465 Power-module assembly
A method of forming a power-module assembly includes arranging power stages in a cavity of a container such that the power stages are spaced apart from walls of...
US-1,012,3464 Heat dissipating system
Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also...
US-1,012,3463 Liquid submerged, horizontal computer server rack and systems and method of cooling such a server rack
Apparatus, systems, and methods for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently...
US-1,012,3462 Ducted exhaust equipment enclosure
An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more...
US-1,012,3461 Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly
A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly,...
US-1,012,3460 System and method for thermal management of electronic devices
A thermal management system and method for electronic devices is provided. The system includes an electronic device, a heat sink, and a thermally conducting and...
US-1,012,3459 Thermal Module
A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and...
US-1,012,3458 Electrical switch and mounting assembly therefor
A mounting assembly is for an electrical switch. The electrical switch has a heat sink. The mounting assembly includes a switching member, an insulator...
US-1,012,3457 Cooling apparatus and electronic device
A cooling apparatus includes: an evaporator in which a coolant is housed and that evaporates the coolant; a condenser that condenses the coolant evaporated by...
US-1,012,3456 Phase change material heat sink using additive manufacturing and method
A heat sink is provided that includes a lower shell, an upper shell and an internal matrix. The lower shell, the upper shell and the internal matrix are formed...
US-1,012,3455 Liquid cooling arrangement
Arrangement for cooling, with liquid, one or more electrical devices or structural units of an electrical device that is/are in at least one installation...
US-1,012,3454 Electronic-device cooling system
Provided is a cooling system capable of improving the cooling performance of an electronic device and being simple and efficient. The cooling system has a...
US-1,012,3453 Electronic apparatus cooling system
Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the...
US-1,012,3451 Data centre
A data center comprises a plurality of sections assembled together to define a unitary structure such that there exists at least one personnel area that spans...
US-1,012,3450 High voltage direct current power generator for computer server data centers
Some embodiments include a high voltage direct current (HVDC) power generator system for information technology (IT) racks. The HVDC power generator system can...
US-1,012,3449 Cable brackets for datacenter racks
Examples herein relate to a cable bracket for a datacenter rack, the cable bracket includes a plurality of retention clamps, each retention clamp adapted to...
US-1,012,3447 Slam latch
A slam latch includes a retaining screw that is held in position by a distal upper support that constrains a distal portion of the retaining screw from moving...
US-1,012,3446 Server device
A server device includes a chassis and at least one server assembly. The chassis has at least one accommodating space, at least one first surface, at least one...
US-1,012,3444 Communications bladed panel systems
A fiber panel system includes a chassis and at least blades configured to mount to the chassis. Each blade is moveable relative to the chassis between a...
US-1,012,3443 Semiconductor device
A semiconductor device including: a plurality of semiconductor units each constituting a three-level inverter circuit; and a connection unit electrically...
US-1,012,3442 High power density power supply
A high power density power supply includes a plurality of cooling fans in a casing. Two sides of the cooling fans are provided with a first filter circuit board...
US-1,012,3441 Memory device with daughter board fastening structure
A memory device is provided. The memory device includes a motherboard, a controller, a first memory unit, a second memory unit and a heat sink. The motherboard...
US-1,012,3440 Electrical device having a housing and a lid which may be placed on the housing
An electrical device having a housing and a lid which may be placed on the housing. A sealing element is situated in a depression of the housing, in particular...
US-1,012,3439 Cover and electronic device
An electronic device includes a casing, an electronic assembly and a cover. The casing has an interior space. The electronic assembly is located in the interior...
US-1,012,3438 Electronic apparatus and method of manufacturing same
To provide an electronic apparatus which enables manufacturing costs to be reduced and a range of selection of materials for resin components to be widened. An...
US-1,012,3437 Electronic device and assembly method thereof
An electronic device is provided, including a housing, a channel, and a flexible circuit. The housing includes a frame and a buffer structure connected to the...
US-1,012,3436 Live load indicator with door interlock
A monitoring system is provided for monitoring a status of current supply through a current supply conductor 5 in an electrical housing 1. A current transformer...
US-1,012,3435 Display control module and display device including the same
Disclosed is a display control module including a supporting member including a pair of external coupling parts for attaching to an external surface in a...
US-1,012,3434 Coupler and head mounted display device
A head mounted display device is provided. The head mounted display device includes a main frame including a lens, a front case including a seating area in...
US-1,012,3433 Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for...
A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an...
US-1,012,3432 Simultaneous and selective wide gap partitioning of via structures using plating resist
A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer....
US-1,012,3431 Methods of defect inspection of plated through hole structures utilizing fluorescent conductive fill material
A microelectronic substrate may be fabricated having a substrate core with at least one plated through hole extending therethrough, wherein the plated through...
US-1,012,3430 Materials for use with interconnects of electrical devices and related methods
Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed...
US-1,012,3429 Mounting of components on a printed circuit board
A method for mounting components on a printed circuit board comprising the following steps: Arranging a first component on a first surface of the printed...
US-1,012,3428 Package module
A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic...
US-1,012,3427 Inkjet system for printing a printed circuit board
A printing process for printing an ink pattern on a substrate is provided. The ink pattern to be printed is based on an available pattern layout. The pattern...
US-1,012,3426 Semiconductor integrated circuit device, printed board and manufacturing method of the semiconductor integrated...
A semiconductor integrated circuit device includes a component built-in board in which at least a first core layer on which a first electronic component is...
US-1,012,3425 Solid electrolytic capacitor module with improved planarity
A module containing a plurality of active capacitors and a sacrificial capacitor is provided. The active capacitors and sacrificial capacitor are aligned along...
US-1,012,3424 Printed circuit board and display device including the same
Provided are display devices. The display device comprises: a printed circuit board (PCB); an under-panel sheet which is disposed on the PCB and in which a...
US-1,012,3423 Thinned electronic product and manufacturing method thereof
A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a...
US-1,012,3422 Coil component and circuit board having the same
Disclosed herein is a coil component that includes a drum-shaped core having a first flange part provided at one end of a winding core part, first to fourth...
US-1,012,3421 Capacitor mounting structure
In an embodiment, with a capacitor mounting structure 200, series-connected first multilayer capacitor 211 and second multilayer capacitor 212 are placed in...
US-1,012,3420 Coil electronic component
A coil electronic component includes: a magnetic body including first and second coil parts spaced apart from each other, wherein the coil parts each include...
US-1,012,3419 Surface-mountable power delivery bus board
IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a...
US-1,012,3418 Circuit board structure and manufacturing method thereof
A circuit board structure including an insulating layer, first and second dielectric layers, and first and second inductors is provided. The insulating layer...
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