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| United States Patent Application |
20060081882
|
| Kind Code
|
A1
|
|
Malenfant; Patrick Roland Lucien
;   et al.
|
April 20, 2006
|
High performance field effect transistors comprising carbon nanotubes
fabricated using solution based processing
Abstract
The present invention is directed toward field effect transistors (FETs)
and thin film transistors (TFTs) comprising carbon nanotubes (CNTs) and
to methods of making such devices using solution-based processing
techniques, wherein the CNTs within such devices have been fractionated
so as to be concentrated in semiconducting CNTs. Additionally, the
relatively low-temperature solution-based processing achievable with the
methods of the present invention permit the use of plastics in the
fabricated devices.
| Inventors: |
Malenfant; Patrick Roland Lucien; (Clifton Park, NY)
; Lee; Ji-Ung; (Niskayuna, NY)
; Li; Yun; (Schenectady, NY)
; Cicha; Walter Vladimir; (Schenectady, NY)
|
| Correspondence Address:
|
GENERAL ELECTRIC COMPANY;GLOBAL RESEARCH
PATENT DOCKET RM. BLDG. K1-4A59
NISKAYUNA
NY
12309
US
|
| Assignee: |
General Electric Company
|
| Serial No.:
|
966793 |
| Series Code:
|
10
|
| Filed:
|
October 15, 2004 |
| Current U.S. Class: |
257/203; 257/213; 361/226; 438/128 |
| Class at Publication: |
257/203; 438/128; 257/213; 361/226 |
| International Class: |
H01L 21/82 20060101 H01L021/82; H01L 27/10 20060101 H01L027/10; B05B 5/053 20060101 B05B005/053; H01L 29/76 20060101 H01L029/76 |
Claims
1. A method comprising the steps of: a) dispersing a mixture of metallic
and semiconducting carbon nanotubes in a solvent comprising a
fractionating agent to form a dispersion; b) centrifuging the dispersion
to effect, with the aid of the fractionating agent, a fractionation of
carbon nanotubes by electronic type into sediment and supernatant, such
that the supernatant becomes enriched in semiconducting carbon nanotubes;
and c) transferring the carbon nanotubes from the supernatant to a
substrate to serve as active semiconducting material in a field effect
transistor.
2. The method of claim 1, wherein the solvent is selected from the group
consisting of CHCl.sub.3, CH.sub.2Cl.sub.2, ODCB, benzene, toluene,
xylenes, mesitylene, DMF, DMSO, water, and combinations thereof.
3. The method of claim 1, wherein the fractionating agent is selected from
the group consisting of chemical adsorbates, polymeric species,
oligomeric species, surfactants, and combinations thereof.
4. The method of claim 3, wherein attached to the fractionating agent is a
dendritic species.
5. The method of claim 1, wherein the fractionating agent is a polymeric
species.
6. The method of claim 5, wherein the polymeric species is amphiphilic.
7. The method of claim 5, wherein the polymeric species is a conjugated
polymer.
8. The method of claim 5, wherein the polymeric species is selected from
the group consisting of polythiophenes, polythiophene derivatives,
poly(bithiophene-fluorenes) single-stranded DNA, and combinations
thereof.
9. The method of claim 5, wherein the polymeric species is P3HT.
10. The method of claim 1, wherein the step of transferring involves a
transfer of the supernatant to the substrate followed by a solvent
removal process.
11. The method of claim 1, wherein the step of transferring involves
isolating carbon nanotubes from the supernatant prior to transferring
them to the substrate.
12. The method of claim 1, wherein the step of transferring involves the
transfer of carbon nanotubes in a polymeric matrix.
13. The method of claim 1, wherein the active semiconducting material
further comprises at least one additional material selected from the
group consisting of polymeric material, oligomeric material, aromatic
organic molecules, C.sub.60, and combinations thereof.
14. The method of claim 13, wherein the additional material dopes the
carbon nanotubes in a manner selected from the group consisting of
n-doping and p-doping.
15. The method of claim 1, wherein at least some of the carbon nanotubes
have been shortened by a process selected from the group consisting of
chemical shortening processes, physical cutting processes, and
combinations thereof.
16. A field effect transistor comprising: a) a plastic substrate; b) a
gate electrode; c) a dielectric layer in contact with the gate electrode;
d) a semiconducting active material in contact with the dielectric layer,
wherein the semiconducting active material comprises carbon nanotubes,
the carbon nanotubes having been non-destructively enriched in
semiconducting carbon nanotubes; and e) source and drain electrodes in
contact with the semiconducting active material.
17. The field effect transistor of claim 16, wherein the semiconducting
active material further comprises material selected from the group
consisting of polymeric material, oligomers, single-stranded DNA,
polyethylenimine, C.sub.60, aromatic organic molecules, and combinations
thereof.
18. The field effect transistor of claim 16, wherein the semiconducting
active material further comprises a polymeric material in contact with
the carbon nanotubes.
19. The field effect transistor of claim 18, wherein the polymeric
material has dendritic material attached to it.
20. The field effect transistor of claim 16, wherein the semiconducting
active material further comprises a polythiophene material.
21. The field effect transistor of claim 16, wherein the transistor
realizes charge carrier mobility in the semiconductor active region that
is between about 10.sup.-3 cm.sup.2/Vsec and about 10.sup.5
cm.sup.2/Vsec.
22. The field effect transistor of claim 16, wherein the transistor
realizes charge carrier mobility in the semiconductor active region that
is between about 10.sup.-1 cm.sup.2/Vsec and about 30 cm.sup.2/Vsec.
23. The field effect transistor of claim 16, wherein the carbon nanotubes
within the semiconducting active material have a density high enough to
achieve a percolation threshold.
24. The field effect transistor of claim 16, wherein the transistor is
part of a matrix-addressable array, with each node in the array
comprising at least one such transistor.
25. A field effect transistor comprising: a) input and output electrodes;
and b) a semiconducting active material coupled to the input and output
electrodes, wherein the semiconducting active material comprises carbon
nanotubes, the carbon nanotubes having been non-destructively enriched in
semiconducting carbon nanotubes.
26. The field effect transistor of claim 25, wherein the substrate is a
polymeric material.
27. The field effect transistor of claim 25, wherein the semiconducting
active material further comprises material selected from the group
consisting of polymeric material, oligomers, single-stranded DNA,
polyethylenimine, C.sub.60, aromatic organic molecules, and combinations
thereof.
28. The field effect transistor of claim 25, wherein the semiconducting
active material further comprises a polythiophene material.
29. The field effect transistor of claim 25, wherein the transistor
realizes charge carrier mobility in the semiconductor active region that
is between about 10.sup.-3 cm.sup.2/Vsec and about 10.sup.5
cm.sup.2/Vsec.
30. The field effect transistor of claim 25, wherein the transistor
realizes charge carrier mobility in the semiconductor active region that
is between about 10.sup.-1 cm.sup.2/Vsec and about 30 cm.sup.2/Vsec.
31. The field effect transistor of claim 25, wherein the carbon nanotubes
within the semiconducting active material have a density high enough to
achieve a percolation threshold.
32. The field effect transistor of claim 25, wherein the transistor is
part of a matrix-addressable array, with each node in the array
comprising at least one such transistor.
33. A field effect transistor comprising: a) a plastic substrate; b) a
gate electrode; c) a dielectic layer in contact with the gate electrode;
d) source and drain electrodes; and e) a semiconducting active material
bridging the source and drain electrodes, the material comprising a
nanotube network of semiconducting and metallic carbon nanotubes, wherein
the nanotube network has a nanotube density sufficient to achieve
percolation threshold and below a level that would short the device.
34. The field effect transistor of claim 33, wherein the semiconducting
active material further comprises material selected from the group
consisting of polymeric material, oligomers, single-stranded DNA,
polyethylenimine, C.sub.60, aromatic organic molecules, and combinations
thereof.
35. The field effect transistor of claim 33, wherein the semiconducting
active material further comprises a polythiophene material.
36. The field effect transistor of claim 33, wherein the transistor
realizes charge carrier mobility in the semiconductor active region that
is between about 10.sup.-3 cm.sup.2/Vsec and about 10.sup.5
cm.sup.2/Vsec.
37. The field effect transistor of claim 33, wherein the transistor
realizes charge carrier mobility in the semiconductor active region that
is between about 10.sup.-1 cm.sup.2/Vsec and about 30 cm.sup.2/Vsec.
38. The field effect transistor of claim 33, wherein the transistor is
part of a matrix-addressable array, with each node in the array
comprising at least one such transistor.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application is related to commonly assigned co-pending
U.S. patent application Ser. No. 10/925,312, filed Aug. 24, 2004,
incorporated by reference herein.
TECHNICAL FIELD
[0002] The present invention relates generally to methods for preparing
field effect transistors (FETs), and more specifically to FETs comprising
carbon nanotubes and to methods for preparing such FETs.
BACKGROUND INFORMATION
[0003] Organic-based electronic devices, in which the active
semiconducting material is an organic compound (e.g., pentacene) or
conjugated polymer (e.g., poly(3-alkylthiophene)), are attractive for
their relatively inexpensive, low-temperature processability. However,
such organic-based devices generally have limited application due to the
low field effect mobilities (.mu.) realized in such devices and their
poor reliability (e.g., reproducibility, variable threshold voltage, air
stability, and processability). Different organic materials have been
screened in traditional organic thin film transistors (TFTs), yet the
mobilities in such materials are generally not much greater than about 1
cm.sup.2/Vsec (C. Dimitrakopoulos et al., "Organic Thin Film Transistors
for Large Area Electronics," Adv. Mater., 2002, 14(2), 99-117). While
organic TFTs with field effect mobilities of 15 cm.sup.2/Vsec have been
reported with pentacene devices on treated silicon via evaporation, such
results have not been reproducible (T. Kelly et al., ACS ProSpective
Meeting, Thin-Film Electronics: Materials, Devices, and Applications,
Jan. 25-28, 2004, Miami, Fla.). Single crystals of organic materials have
been shown to have mobilities as high as 10-15 cm.sup.2/Vsec, but they
are difficult to produce and still do not approach the mobility of 100
cm.sup.2/Vsec anticipated to be required for high-performance devices and
circuits (V. Sundar et al., "Elastomeric Transistor Stamps: Reversible
Probing of Charge Transport in Organic Crystals," Science, 2004, 303,
1644-1647). Thus, high-performance field effect transistors (FETs) on
plastic cannot be achieved with traditional organic materials, or, for
that matter, with silicon, since in the latter case processing methods
are limited to amorphous silicon.
[0004] It would be highly desirable to be able to manufacture high
mobility TFTs with low-temperature, solution-based processing techniques
that would allow low cost, high-performance devices for large area
electronics. Indeed, such a processing method has been a long-sought
after goal as higher mobilities would allow faster switching in high-end
displays and permit logic applications (C. Dimitrakopoulos et al.,
"Organic Thin Film Transistors for Large Area Electronics," Adv. Mater.,
2002, 14(2), 99-117). Hence, the problem to be overcome is three-fold:
limited processing capability, poor performance, and poor reliability of
traditional organic TFTs.
[0005] There has been considerable effort to overcome the above-described
problems by replacing the semiconducting material in such TFTs with a
carbon nanotube (CNT) network (Baughman et al., Carbon Nanotubes--the
Route Toward Applications," Science, 2002, 297, 787-792; Dai, "Carbon
Nanotubes: Synthesis, Integration, and Properties," Acc. Chem. Res.,
2002, 35, 1035-1044). While CNT transistors based on the use of a single
CNT per channel are not currently commercializable due to expensive,
unreliable, and uncontrollable processes, CNT transistors based on CNT
networks have been prepared by growing CNT networks on silicon substrates
at high temperatures, temperatures that are not compatible with plastic
substrates. Transport properties of such single-wall carbon nanotube
(SWNT) network transistors have been reported as having mobilities of 10
cm.sup.2/Vsec and I.sub.on/I.sub.off of 10.sup.5. At higher SWNT
densities, mobilities of 100 cm.sup.2/Vsec are obtained, but with a high
off current (I.sub.off) (Snow et al., "Random Networks of Carbon
Nanotubes as an Electronic Material," Appl. Phys. Lett., 2003, 82(13),
2145-2147). Furthermore, such in situ growth of CNTs directly on
substrates provides an uncontrollable mixture of semiconducting and
metallic tubes such that on/off ratios of such devices are poor (Xiao et
al., "High-Mobility Thin-Film Transistors Based on Aligned Carbon
Nanotubes," Appl. Phys. Lett., 2003, 83, 150-152). Such in situ growth
processes also tend to be low yield processes.
[0006] Martel et al. (Appl. Phys. Lett., 1998, 73, 2447) prepared
single-tube devices by dispersing a dilute suspension of CNTs onto a
substrate and then patterned electrodes on the surface comprising the
CNTs. However, this process is not practical, as described therein, and
the metallic CNTs still present can lead to short-circuited devices.
[0007] The fabrication of TFTs based on single-wall carbon nanotube (SWNT)
networks has been accomplished on silicon substrates from which they were
then transferred to plastic substrates (Bradley et al., "Flexible
Nanotube Electronics," Nano Lett., 2003, 3(10), 1353-1355). Such a
transfer process is not practical or cost-effective, however, and growing
tubes (individual or network) on plastic is not possible due to the high
temperatures typically required.
[0008] DNA-streptavidin complexes have been used to assemble templated CNT
FETs using single, isolated semiconducting CNTs (Keren et al.,
"DNA-Templated Carbon Nanotube Field-Effect Transistor," Science, 2003,
302, 1380-1382). However, as already mentioned, such single CNT devices
are not practical and such methods still require isolation of
semiconducting CNTs.
[0009] Efforts to overcome processing limitations of in situ CNT growth
for FET devices have led some to fabricate silicon-based nanowires on
plastic substrates (McAlpine et al., "Nanoimprint Lithography for Hybrid
Plastic Electronics," Nano Lett., 2003, 3(4), 443-445; Duan et al.,
"High-Performance Thin-Film Transistors Using Semiconductor Nanowires and
Nanoribbons," Nature, 2003, 425, 274-278; McAlpine et al.,
"High-Performance Nanowire Electronics and P
hotonics on Glass and Plastic
Substrates," Nano Lett., 2003, 3(11), 1531-1535). Such nanowires are
limited, as they are typically produced in very low yield and readily
oxidize in air. Furthermore, inorganic nanowires suffer from trapped
states on the nanowire surface and difficulties in doping.
[0010] Several recent publications have described processes to separate
semiconducting SWNTs from metallic SWNTs (D. Chattopadhyay et al., "A
Route for Bulk Separation of Semiconducting from Metallic Single-Wall
Carbon Nanotubes," J. Am. Chem. Soc., 2003, 125, 3370; M. Zheng et al.,
"Structure-Based Carbon Nanotube Sorting by Sequence-Dependent DNA
Assembly," Science, 2003, 302, 1545-1548; Weisman, "Four Degrees of
Separation," Nat. Mater., 2003, 2, 569-570), yet no one has used these
processes to fabricate TFT based on solution-cast SWNT networks that are
enriched with semiconducting SWNTs.
[0011] Selective chemistry to render the metallic SWNTs non-conducting has
been developed. Such chemistry selectively reacts metallic SWNTs in the
presence of semiconducting SWNTs. Such chemistry disrupts the conjugation
of the metallic SWNTs and effectively destroys their metallic character
(M. Strano et al., Science, 2003, 301, 1519). Recently, this approach has
been used to fabricate FETs comprising CNTs grown in situ on a device
platform (L. An et al., "A Simple Chemical Route to Selectively Eliminate
Metallic Carbon Nanotubes in Nanotube Network Devices," J. Am. Chem.
Soc., 2004, 126(34), 10520-10521), but such processing still requires
high temperatures to generate the CNTs and leaves chemically-destroyed
metallic CNTs in the device and this chemistry is acknowledged by the
authors to not be completely selective.
[0012] In light of the above, a method to inexpensively manufacture FETs,
and TFTs in particular, at low temperatures using both solution-based
processing and CNTs to provide high field effect mobilities would be
highly desirable, as it would permit such devices to be fabricated with
plastic substrates. Such resulting low-cost devices would allow their
incorporation into articles of manufacture heretofore economically
unrealizable.
BRIEF DESCRIPTION OF THE INVENTION
[0013] Some embodiments of the present invention are directed toward field
effect transistors (FETs) comprising carbon nanotubes (CNTs) and to
methods of making such devices using solution based processing
techniques, wherein the CNTs within such devices have been fractionated
so as to be concentrated in semiconducting CNTs. Additionally, the
relatively low temperature solution-based processing methods permit the
use of plastics in the fabricated devices.
[0014] Generally, such FET devices comprise: 1) a substrate; 2) a gate
electrode; 3) a dielectric layer in contact with the gate electrode; 4) a
semiconducting active material in contact with the dielectric layer,
wherein the semiconducting active material comprises carbon nanotubes,
the carbon nanotubes having been non-destructively enriched in
semiconducting carbon nanotubes; and 5) source and drain electrodes in
contact with the semiconducting active material.
[0015] Generally methods of making such FET devices comprise the steps of:
1) dispersing carbon nanotubes in a solvent comprising a fractionating
agent to form a dispersion; 2) centrifuging the dispersion to effect,
with the aid of the fractionating agent, a fractionation of carbon
nanotubes by electronic type into sediment and supernatant formed by the
centrifuging, such that the supernatant becomes enriched in
semiconducting carbon nanotubes; and 3) transferring the carbon nanotubes
from the supernatant to a substrate to serve as active semiconducting
material in a field effect transistor.
[0016] Many embodiments of the present invention offer advantages over the
prior art including low temperature solution-based processing, and the
use of carbon nanotubes to afford enhanced performance relative to
traditional organic-based FETs. Low temperature solution-based processing
methods permit the use of a broad range of materials in the processing of
FET devices in accordance with some embodiments of the present invention.
Furthermore, use of CNTs overcomes many of the performance and operating
limits of organic-based FETs, while maintaining solution based
processability. Finally, the fractionation techniques described herein
can enable a concentrating of semiconducting CNTs within a given CNT
population capable of affording superior properties when incorporated
into a FET device.
[0017] While much of the discussion herein is directed at single-wall
carbon nanotubes (SWNTs), it will be understood by those of skill in the
art that the scope of such exemplary embodiments can be extended to
include multi-wall carbon nanotubes (MWNTs) and particularly double-wall
carbon nanotubes.
[0018] In accordance with some embodiments of the present invention,
applications for the devices include, but are not limited to, liquid
crystal displays (LCDs), organic light emitting diode (OLED) displays,
radiofrequency identification (RFID), sensors, and X-ray detectors. While
some applications involve a mere replacement of existing FET devices, new
applications for such FET devices will present themselves as a result of
their high performance and processing flexibility.
[0019] The foregoing has outlined rather broadly the features of the
present invention in order that the detailed description of the invention
that follows may be better understood. Additional features and advantages
of the invention will be described hereinafter which form the subject of
the claims of the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] For a more complete understanding of the present invention, and the
advantages thereof, reference is now made to the following descriptions
taken in conjunction with the accompanying drawings, in which:
[0021] FIG. 1 illustrates a TFT device in accordance with embodiments of
the present invention;
[0022] FIG. 2 illustrates another TFT device in accordance with
embodiments of the present invention;
[0023] FIG. 3 is a flow diagram illustrating embodiments by which FET
devices of the present invention can be fabricated;
[0024] FIG. 4 is a flow diagram illustrating the steps involved in
fractionating CNTs to provide CNT populations enriched in semiconducting
CNTs;
[0025] FIG. 5 is a 514 nm Raman spectra of SWNTs solvent-cast onto quartz
from CHCl.sub.3;
[0026] FIG. 6 shows a radial breathing mode (RBM) region 633 nm Raman
spectra of SWNTs solvent-cast onto quartz from CHCl.sub.3;
[0027] FIG. 7 shows a tangential band region 633 nm Raman spectra of SWNTs
solvent-cast onto quartz from CHCl.sub.3;
[0028] FIG. 8 is an UV/vis/NIR absorption spectrum showing the attachment
of the polymer P3HT with SWNTs;
[0029] FIG. 9 is an UV/vis/NIR absorption spectrum of pristine or
untreated SWNTs in CHCl.sub.3;
[0030] FIG. 10 illustrates yet another TFT device in accordance with
embodiments of the present invention;
[0031] FIG. 11 illustrates a TFT testing device in accordance with
Examples 5-7;
[0032] FIG. 12 is a cross-sectional side view of region 1200, identified
by dashed borders in FIG. 11;
[0033] FIG. 13 is an AFM image depicting SWNT density on a substrate,
according to an embodiment of the present invention;
[0034] FIG. 14 is a transfer curve for the device in Example 6;
[0035] FIG. 15 is an SEM image of SWNTs dispersed onto the testing device
of Example 5;
[0036] FIG. 16 is an SEM image depicting a higher magnification of one
portion of the area shown in FIG. 15; and
[0037] FIG. 17 depicts a transfer curve for the device in Example 7.
DETAILED DESCRIPTION OF THE INVENTION
[0038] In the following description, specific details are set forth such
as specific quantities, sizes, etc. so as to provide a thorough
understanding of embodiments of the present invention. However, it will
be obvious to those skilled in the art that the present invention may be
practiced without such specific details. In many cases, details
concerning such considerations and the like have been omitted inasmuch as
such details are not necessary to obtain a complete understanding of the
present invention and are within the skills of persons of ordinary skill
in the relevant art.
[0039] Referring to the drawings in general, it will be understood that
the illustrations are for the purpose of describing a particular
embodiment of the invention and are not intended to limit the invention
thereto.
[0040] In some embodiments, the present invention is directed toward field
effect transistors (FETs) comprising carbon nanotubes (CNTs) and to
methods of making such devices using solution based processing
techniques, wherein the CNTs within such devices have been fractionated
so as to be concentrated in semiconducting CNTs. Additionally, the
relatively low temperature solution-based processing achievable with the
methods of the present invention permits the use of plastics in the
fabricated devices, particularly wherein such devices are thin film
transistors (TFTs).
[0041] A "field effect transistor," as used herein and abbreviated "FET"
is a three-terminal semiconductor device in which the current flow
through one pair of terminals, the source and the drain, is controlled or
modulated by an electric field that penetrates the semiconductor; this
field is introduced by the voltage applied at the third terminal, the
gate.
[0042] A "thin film transistor," as used herein and abbreviated "TFT" is
an FET that is fabricated using thin-film techniques generally on an
insulating substrate rather than on a semiconductor chip. In some
embodiments, the insulating substrate is silicon with an oxide surface
layer. The insulating substrate reduces the bulk capacitance of the
device and hence the operating speed can be increased.
[0043] "Carbon nanotubes," as used herein and abbreviated "CNTs," refer to
all-carbon tubes or cylinders having diameters on the order of about 0.5
nm to about 100 nm. "Single-wall carbon nanotubes," abbreviated "SWNTs"
are but a single graphene sheet rolled upon itself to form such a
cylinder (Iijima et al., "Single-Shell Carbon Nanotubes of 1-nm
Diameter," Nature, 1993, 363, 603-605), whereas "multi-wall carbon
nanotubes," abbreviated "MWNTs" are comprised of a plurality of such
rolled sheets concentrically arranged like a Russian nesting doll
(Iijima, "Helical Microtubules of Graphitic Carbon," Nature, 1991, 354,
56-58), the simplest being a double-wall carbon nanotube. The diameter
and helicity of such nanotubes can be described by a roll-up vector (n,m)
(Dai, "Carbon Nanotubes: Synthesis, Integration, and Properties," Acc.
Chem. Res., 2002, 35, 1035-1044). When |n-m|=3k, where k is an integer or
zero, the nanotube is metallic. All other combinations of n and m result
in semiconducting nanotubes.
[0044] "Plastics," as used herein, generally refers to all processible
forms of polymeric material, such polymeric material including, but not
limited to, thermoplastics, thermosets, elastomers, and combinations
thereof. "Polymeric material," is further defined to encompass polymer
precursor materials (e.g., monomers), oligomers, epoxy resins, cyanate
resins, and dendritic materials.
[0045] "Solvent-casting," or "solution-casting," as used herein, generally
refers to the deposition of a carbon nanotube-containing solution or
suspension onto a substrate. "Spin-casting," as used herein, generally
refers to the deposition of such solutions/suspensions onto a spinning
(i.e., rotating) substrate.
[0046] Generally, field effect transistors of the present invention
comprise: 1) input and output electrodes; and 2) a semiconducting active
material coupled to the input and output electrodes, wherein the
semiconducting active material comprises carbon nanotubes, the carbon
nanotubes having been non-destructively enriched in semiconducting carbon
nanotubes.
[0047] Depending on the embodiment, the dimensions of such FET devices of
the present invention can be varied considerably. Typically, the size of
such devices can vary such their channel widths are between about 50 nm
and about 1 mm, and their channel lengths are between about 50 nm and
about 100 .mu.m.
[0048] As a purely semiconducting population of CNTs cannot be synthesized
directly (i.e., such synthesis procedures always yield mixtures of
metallic and semiconducting CNTs), enrichment of a CNT mixture in either
metallic or semiconducting concentration must be carried out
post-synthesis. While some such methods of enrichment rely on selective
chemical reactivity of metallic CNTs, these techniques are "destructive"
in that they chemically alter the metallic nanotubes. The present
invention relies primarily on non-destructive enrichment techniques to
fractionate populations of CNTs. Such non-destructive
enrichment/separation is described in commonly assigned co-pending U.S.
patent application Ser. No. 10/925,312, filed Aug. 24, 2004.
[0049] More specifically, the FET devices of the present invention can
comprise 1) a substrate; 2) a gate electrode; 3) a dielectric layer in
contact with the gate electrode; 4) a semiconducting active material in
contact with the dielectric layer, wherein the semiconducting active
material comprises carbon nanotubes, the carbon nanotubes having been
non-destructively enriched in semiconducting carbon nanotubes; and 5)
source and drain electrodes in contact with the semiconducting active
material. In some embodiments of the present invention, the FET devices
of the present invention are TFTs.
[0050] Examples of TFT devices, in accordance with some embodiments of the
present invention, are shown in FIGS. 1 and 2. Referring to FIG. 1, TFT
device 100 comprises a substrate 101 in contact with gate electrode 102
and dielectric layer 103. Still referring to FIG. 1, a semiconducting
layer 104 resides on dielectric layer 103, and source and drain
electrodes 105 and 106, respectively, reside on semiconducting layer 104.
Referring to FIG. 2, TFT device 200 comprises a substrate 201 in contact
with a gate electrode 202 and a dielectric layer 203. Residing on
dielectric layer 203 are source and drain electrodes 205 and 206,
respectively, as well as semiconducting layer 204. Other suitable
configurations exist, as will be appreciated by those of skill in the
art.
[0051] Substrates for devices of the present invention may be plastic.
Such substrates, are not, however, limited to plastic. Substrates can be
of any material or combinations of material that suitably provides for a
substrate in accordance with the present invention. Other such substrate
materials include, but are not limited to, silicon, glass, plastic, metal
foil, ceramic, and combinations thereof.
[0052] Examples of gate electrode materials include, but are not limited
to, gold, platinum, molybdenum, carbon nanotubes, conducting polymers
(with and without carbon nanotubes), and combinations thereof.
[0053] Exemplary dielectric materials include, but are not limited to,
SiO.sub.2, nitrides, spin-on-glass, polyimides, polyvinylphenol,
parylene, and combinations thereof.
[0054] As noted above, the semiconducting active material comprises CNTs.
Such CNTs are generally mixtures of metallic and semiconducting CNTs that
have been enriched in semiconducting nanotubes. Such CNTs can be SWNTs,
MWNTs, and combinations thereof. In some embodiments, such CNT
populations may comprise chemically-functionalized CNTs.
[0055] The lengths of the CNTs within such a semiconductive active layer
may vary from about 20 nm to about 100 .mu.m, but other lengths are
possible outside this range. The choice of particular lengths or ranges
of lengths is, at least in part, dependent upon the dimensions of the
device(s) they are being incorporated into, particularly the distance
between the source and drain electrodes.
[0056] In addition to CNTs, the semiconductor active region may further
comprise one or more different polymeric materials, wherein the polymeric
materials can be conductive polymers, non-conductive polymers, or
combinations thereof. Such polymeric materials can be conjugated,
non-conjugated, or combinations thereof. In some embodiments, the CNTs
are dispersed in a polymeric matrix comprising such above-described
polymeric material. Such polymeric materials include, but are not limited
to, polythiophenes, polythiophene derivatives,
poly(bithiophene-fluorenes), and combinations thereof. In some
embodiments, dendritic materials are attached to such polymeric
materials, i.e., dendrimers attached to a polymer backbone at one or more
locations, typically one or both ends. Suitable dendritic material
includes, but is not limited to, aliphatic ethers, aliphatic esters,
aliphatic amines, aliphatic amides, aromatic ethers, aromatic esters,
aromatic amines, aromatic amides, aromatic alkynes, phenylenes, aromatic
alkenes, polyether carbamates, and combinations thereof.
[0057] In some embodiments, additional materials are added to the CNTs
and/or polymeric material in the semiconducting active layer. Such
additional materials include, but are limited to, polymeric material,
oligomers, single-stranded DNA, polyethylenimine, C.sub.60, aromatic
organic molecules, and combinations thereof.
[0058] In some embodiments, the additional materials and/or polymeric
material serves to dope or further dope the CNTs within the
semiconducting active region. Such doping can be of the n-type or p-type.
[0059] Generally, the semiconducting active region comprises a CNT density
that is at or above a percolation threshold, wherein a percolation
threshold is defined as the minimum density of nanotubes required to
obtain a conductive path between the source and drain electrodes.
[0060] The FET devices of the present invention comprising CNTs in the
semiconducting active layer or region generally have field effect
mobilities of about 10.sup.-3 cm.sup.2/Vsec to about 10.sup.5
cm.sup.2/Vsec, and typically have field effect mobilities of about 0.1
cm.sup.2/Vsec to about 30 cm.sup.2/Vsec. Such devices further typically
have current modulation (i.e., I.sub.on/I.sub.off ratios) of about 10 to
about 10.sup.5.
[0061] It is important to note that in some embodiments, the FET devices
of the present invention have been fabricated with materials generally
not found in such devices (e.g., plastics), and that such devices made
with such materials exceed the performance characteristics generally
found in organic TFT devices. Such devices are made possible by the
solution-based processing described below.
[0062] Applications for the above-described devices include, but are not
limited to, liquid crystal displays (LCDs), organic light emitting diode
(OLED) displays, radiofrequency identification (RFID), sensors, and X-ray
detectors.
[0063] Generally, methods of the present invention include suspending CNTs
in a solvent to form a suspension, and solvent-casting the suspension
onto a substrate, wherein the CNTs serve as a bridging network between
source and drain electrodes of a FET device.
[0064] In some embodiments, methods of making such FET devices comprise a
number of steps. Referring to FIG. 3, the steps are: (Step 3001)
dispersing carbon nanotubes (i.e., a mixture of semiconducting and
metallic CNTs) in a solvent comprising a fractionating agent to form a
dispersion; (Step 3002) centrifuging the dispersion to effect, with the
aid of the fractionating agent, a fractionation of carbon nanotubes by
electronic type into sediment and supernatant formed by the centrifuging,
such that the supernatant becomes enriched in semiconducting carbon
nanotubes; and (Step 3003) transferring the carbon nanotubes from the
supernatant to a substrate to serves as active semiconducting material in
a field effect transistor. It is an advantage of the present invention
that such methods can be used in the fabrication of devices on plastic
substrates and/or with plastic components.
[0065] Solvents suitable for dispersal of CNTs include, but are not
limited to, N,N-dimethylformamide (DMF), chloroform (CHCl.sub.3),
o-dichlorobenzene (ODCB), dichloromethane (CH.sub.2Cl.sub.2), benzene,
toluene, xylenes, mesitylene, dimethylsulfoxide (DMSO), water, and
combinations thereof. In some embodiments, a surfactant is used to
facilitate the dispersion. In some embodiments, ultrasonication and/or
some form of mechanical agitation is utilized to facilitate such
dispersal. In some embodiments, heat is applied to facilitate dispersal.
[0066] Fractionating agents, according to the present invention, are
species that complex or associate (in a non-covalent, non-destructive
way) with the carbon nanotubes in the dispersion so as to effect a
fractionation of the CNTs by type (i.e., metallic and semiconducting)
when centrifuged, and provide for a supernatant that is enriched in
semiconducting carbon nanotubes. In some embodiments, the fractionating
agents are polymeric. In some embodiments these polymeric fractionating
agents are amphiphilic. In some embodiments, the polymeric fractionating
agents are conductive polymers. Suitable polymers include, but are not
limited to, polythiophenes, polythiophene derivatives,
poly(bithiophene-fluorenes), single-stranded DNA, and combinations
thereof. Suitable polythiophenes include, but are not limited to,
poly-3-hexyl-thiophene (P3HT), the structure of which is shown below.
[0067] In some embodiments, the fractionating agent assists in the
de-bundling and dispersion of CNTs. CNTs, especially SWNTs, tend to
agglomerate into bundles or ropes held together by van der Waals forces.
In such embodiments, there is generally an energetic preference for CNT
contact to the fractionating agent over CNT contact to itself. Such
dispersion and fractionalization are described in commonly assigned
co-pending U.S. patent application Ser. No. 10/925,312, filed Aug. 24,
2004.
[0068] In some embodiments, the fractionating agents comprise dendritic
material. Such dendritic material may be attached to other polymeric
material. Suitable dendritic material includes, but is not limited to,
aliphatic ethers, aliphatic esters, aliphatic amines, aliphatic amides,
aromatic ethers, aromatic esters, aromatic amines, aromatic amides,
aromatic alkynes, phenylenes, aromatic alkenes, polyether carbamates, and
combinations thereof.
[0069] Centrifugation typically is carried out in a centrifuge tube at a
speed between about 1000 rpm and about 5000 rpm for a duration between
about 1 minute and about 20 minutes. Such centrifugation typically yields
sediment and supernatant, the sediment having gravitated to the bottom of
the centrifuge tube and the supernatant being the liquid on top. It is in
these two phases that a fractionation of the CNT mixture is realized: the
sediment being enriched in metallic CNTs and the supernatant being
enriched in semiconducting CNTs-relative to the starting material.
[0070] In some embodiments, transfer of the supernatant to a substrate
first involves a separation of the CNTs within the supernatant from the
CNTs in the sediment. Typically this is done with simple decanting, or by
optional filtration.
[0071] In embodiments wherein the fractionating agent is a polymer, the
optional filtration can remove excess fractionating agent (e.g., polymer)
which is not attached to CNTs, thus allowing a polymer:CNT stoichiometry
to be determined. Typically, the solutions are filtered through a 4-4.5
micron (.mu.m) sintered glass filter and then washed repeatedly with a
solvent. The CNTs attached to a polymer that are isolated by filtration
in this manner are either characterized as-is or redissolved in a solvent
via water bath sonication (5-60 minutes, most typically 30 minutes), and
then characterized.
[0072] In some embodiments, a step of isolating the CNTs from the
supernatant is performed. In some embodiments, the CNTs are freed of
fractionating agent and/or other materials via washings. In some
embodiments, the isolated CNTs are mixed with other materials (e.g.,
polymer or polymer precursor materials) prior to being transferred to the
substrate.
[0073] In some embodiments, the centrifugation/fractionating step and/or
the optional filtration step can be repeated up to numerous times, each
successive iteration leading to a supernatant more thoroughly enriched in
semiconducting CNTs. Ultimately, if enough iterations are employed,
isolated semiconducting CNTs could be obtained.
[0074] In some embodiments, the transferring requires an application
process. Typically, such application processes are solution-based.
Suitable such processes include, but are not limited to, spraying,
spin-coating, brushing, rolling, printing, inkjet printing, screen
printing, and combinations thereof. Solution-based transfer typically
requires a solvent removal step. Typically, such solvent removal employs
an evaporative means.
[0075] As mentioned above, FET devices of the present invention utilizing
CNTs are typically TFT devices. In some embodiments, carbon nanotubes
(CNT) are used as the active semiconductor material (or as a component of
such material) in a thin film transistor (TFT) device that can be
fabricated using simple, solution-based processing that permits the use
of plastic substrates. Key to these devices, and the processes by which
they are made, are the processes by which metallic CNTs can either be
segregated, fractionated, destroyed, or even removed from the CNT
population used to form the network such that the TFTs do not short
circuit due to the high conductivity of the metallic CNTs.
[0076] Metallic and semiconducting CNTs may be segregated by exfoliating
CNT bundles using surfactants or dispersants such as conjugated
oligomers/polymers (see above). In some embodiments, these dispersants
may further allow the physical separation (e.g., fractionation) of
metallic from semiconducting CNTs, thus facilitating device fabrication.
Selective destruction of the metallic CNTs may also be employed in order
to obtain a CNT network that is more largely semiconducting. Selective
destruction may be achieved chemically using known approaches such as
reaction with aryl diazonium salts (Bahr et al., "Functionalization of
Carbon Nanotubes by Electrochemical Reduction of Aryl Diazonium Salts: A
Bucky Paper Electrode," J. Am. Chem. Soc. 2001, 123, 6536-6542).
[0077] The present invention provides a low-cost process that is
solution-based and can be done at relatively low temperatures, and, as a
result, is compatible with plastic substrates. In some exemplary
embodiments, the present invention is directed toward devices based on
SWNT networks that are obtained from SWNTs manufactured using large-scale
production techniques such as the HiPco process (Nikolaev et al.,
"Gas-Phase Catalytic Growth of Single-Walled Carbon Nanotubes from Carbon
Monoxide," Chem. Phys. Lett., 1999, 313, 91-97). These tubes are a
mixture of metallic (.about.30%) and semiconducting (.about.70%) CNTs. In
some embodiments, it is these CNTs that are dispersed in solution and
fractionated into populations of CNTs enriched in metallic CNTs and
semiconducting CNTs, so as to provide for a semiconducting network of
CNTs for use in FET devices. Such CNT populations enriched in
semiconducting CNTs can be further treated chemically in order to
selectively render some or all of the remaining metallic tubes
non-conducting, resulting in a more largely semiconducting CNT network.
See, e.g., L. An et al., "A Simple Chemical Route to Selectively
Eliminate Metallic Carbon Nanotubes in Nanotube Network Devices," J. Am.
Chem. Soc., 2004, 126(34), 10520-10521.
[0078] It is worth noting that the use of silicon devices on plastic is
limited to amorphous silicon (deposited chemically), which limits the
performance of such devices on plastic (mobility .about.1 cm.sup.2/Vsec).
This problem is addressed herein by using CNTs, such as in the form of
SWNT networks, which can provide mobilities generally greater than about
10 cm.sup.2/Vsec and more typically up to about 100 cm.sup.2/Vsec due to
the ballistic nature of transport in SWNTs. This would allow fabrication
of all of the circuitry in a liquid crystal display (LCD) using SWNT
devices.
[0079] In some embodiments, the present invention is directed to processes
by which TFTs based on SWNT networks are fabricated. SWNT dispersions in
solution are used to fabricate TFTs (using solution-based processing) in
which the semiconducting channel of the TFT is a SWNT network. The first
process relies on dispersions that are highly optimized such that
segregating and/or fractionating metallic SWNTs from semiconducting SWNT
yields a suitably semiconducting network upon deposition in a TFT
channel. The use of conjugated polymers/oligomers allows and facilitates
the dispersion of SWNTs such that SWNT bundles (containing both metallic
and semiconducting SWNTs) can be exfoliated into individual SWNTs, and
provides for fractionation of such metallic and semiconducting SWNTs from
each other upon centrifuging, thus resulting in a semiconducting SWNT
network upon deposition onto a substrate. The channel length can also be
adjusted to assure that no individual tube spans its length, thus
precluding a metallic tube, either alone or in a bundle, from
short-circuiting the TFT. Other types of dispersants are also envisioned
(surfactants and other non-polymeric weakly associated species, often
being water soluble). The substrate may be a plastic substrate.
[0080] In some embodiments, selective reagents are employed to further
modify the electronic properties of the metallic SWNT (i.e. render them
non-conducting), and such is another process by which one can further
obtain a semiconducting network of SWNT in the TFT channel. This may be
done while dispersing the SWNT in solution, or on the TFT device
directly, after the SWNT network has been formed in the device channel.
This process may be combined with the use of appropriate dispersants.
Examples of covalent chemistry capable of destroying metallic SWNTs
include reaction with aryl diazonium salts (see above).
[0081] Another process involves the dispersion of a semiconducting SWNT
(or other CNT) network into a semiconducting polymer matrix such as
polythiophene. This approach may facilitate the charge injection from the
source and drain electrodes into the channel and subsequently into the
SWNT. This process may also be combined with SWNT physical separation or
selective chemistry to destroy the metallic tubes prior to dispersing
them in the semiconducting polymer.
[0082] A central feature of the present invention is the ability to make
semiconducting SWNT networks from pristine SWNTs exposed to fractionation
treatments and selective chemical destruction of the metallic CNTs. As
such selective chemical destruction is not completely selective, the
combination of these two treatments affords tremendous flexibility in the
processing and higher quality semiconductor active materials that
comprise such semiconducting CNTs. Furthermore, the introduction of the
CNTs into a semiconducting polymer matrix, or directly onto a substrate,
permits the fabrication of better-performing TFTs than traditional
organics or amorphous silicon can provide. The present invention thus
provides a low-cost, solution-based process for making TFTs while not
sacrificing the performance of the TFT (e.g., mobilities of CNT-based
TFTs can be greater than 100 cm.sup.2/Vsec).
EXAMPLES
[0083] The following examples are provided to demonstrate particular
embodiments of the present invention. It should be appreciated by those
of skill in the art that the methods disclosed in the examples which
follow merely represent exemplary embodiments of the present invention.
However, those of skill in the art should, in light of the present
disclosure, appreciate that many changes can be made in the specific
embodiments described and still obtain a like or similar result without
departing from the spirit and scope of the present invention.
Example 1
[0084] This Example serves to illustrate how CNTs can be selectively
fractionated, according to some embodiments of the present invention, by
type to yield CNT populations enriched in semiconducting CNTs.
[0085] CNTs used in this Example were HiPco-produced SWNTs of purified
grade obtained from Carbon Nanotechnologies, Inc. (Houston, Tex.). Such
purified tubes comprised metal impurities (predominantly Fe catalyst) in
a range of 2-20 weight percent. These SWNTs typically have diameters in
the range of 0.7-1.3 nm, lengths in the range of 1-1.5 microns, and an
average electronic bandgap of around 0.8 eV.
[0086] Referring to FIG. 4, such fractionation typically requires three
steps: (Step 4001) solubilization, (Step 4002) centrifugation, and (Step
4003) filtration. These steps are described in more detail below.
[0087] (Step 4001) Solubilization: In vial 1, 0.1-1 mg/ml of purified
SWNTs were partially dispersed in a solvent, most typically CHCl.sub.3,
by sonicating the vial in a water bath for 5-30 minutes, most typically
15 minutes. The total weight of SWNTs used per experiment never exceeded
100 mg. The respective solubilization/fractionation agent was dissolved
(by sonication in water bath) in vial 2 containing the same solvent. The
weight of the fractionating agent used was such that the resulting
fractionation agent:SWNT ratio ranged from 0.1:1 to 20:1 by weight, but
most was typically about 1:1. The contents of vial 2 were added to vial 1
and the mixture was sonicated for between 15 minutes and 3 hours, most
typically about 30 minutes. The resulting solution of wholly or partially
dispersed SWNTs was then processed via purification Step 4002 and/or Step
4003 below.
[0088] (Step 4002) Centrifugation: The solution from Step 4001 was
centrifuged for 2-15 minutes, most typically 5 minutes, at a speed of
between about 1000 to 5000 rpm, most typically 3500 rpm. The sediment
(precipitate) was separated from the supernatant (eluant) and the latter
was processed either in accordance with Step 4003 below, or submitted
directly for characterization. The precipitate either was characterized
as-is or re-dissolved via water bath sonication (5-60 minutes, most
typically 30 minutes), in a solvent, most typically CHCl.sub.3, and then
characterized by Raman spectroscopy. This served as a means of
separating, in whole or in part, dispersed SWNTs from bundled SWNTs.
[0089] (Step 4003) Filtration: Solutions obtained directly from Step 4001,
or after processing according to Step 4002, were filtered through a 4-4.5
micron sintered glass filter and then washed repeatedly with the same
solvent (free fractionating agent was highly soluble in this solvent).
The SWNTs isolated by such filtration were either characterized as-is or
redissolved via water bath sonication (5-60 minutes, most typically 30
minutes), the solvent most typically being CHCl.sub.3, and then
characterized using Raman spectroscopy and
ultraviolet/visible/near-infrared (UV/vis/NIR) spectroscopy. This served
as a means of removing excess fractionating agent from the SWNTs and thus
allowing the determination of the fractionating agent:SWNT stoichiometry.
Example 2
[0090] This Example serves to illustrate how Raman spectroscopy can be
used to confirm fractionation of CNTs.
[0091] Evidence for the selective solubilization of semi-conducting SWNTs
was obtained from Raman studies using a 514 nm laser light source, as
shown in FIG. 5. The relative intensities of the bands in spectrum C
("centrifuge ppte," i.e., post-centrifuge sediment, in FIG. 5) are
significantly different from the intensities in the other three spectra
shown in FIG. 5. This comparison suggests that P3HT partially separates
SWNTs into semiconducting (sc)-enriched (supernatant) and metallic
(met)-enriched (sediment) portions. Analysis of the Raman data was done
in accordance with previous analyses (H. Katahura et al., "Optical
Properties of Single-Wall Carbon Nanotubes," Synthetic Metals, 1999, 103,
2555-2558; M. Dresselhaus et al., "Phonons in Carbon Nanotubes," Advances
in Physics, 2000, 49,705-814).
[0092] While not intending to be bound by theory, Table 1 is a summary and
interpretation of the radial breathing mode (RBM) region of the 514 nm
Raman data obtained for soluble P3HT-SWNT dispersions solvent-cast onto
quartz wafers from CHCl.sub.3 solutions. The spectrum obtained for
pristine, or untreated (i.e., no moiety has been attached), SWNTs
indicates the presence of both semiconducting (sc) and metallic (met)
SWNTs, with the intensities of the peaks of both the sc-SWNTs and
met-SWNTs being relatively strong. In the spectra obtained for both the
P3HT-SWNT dispersion and the supernatant ("supernatant" in Table 1), the
met-SWNT peaks have decreased relative to the intensity of the sc-SWNT
peaks, indicating that the supernatant is enriched in sc-SWNTs as a
result of the selective functionalization and dispersion of the sc-SWNTs.
In the spectrum obtained for the sediment, the situation is reversed, as
the met-SWNT peaks are relatively stronger than the sc-SWNT peaks. This
indicates that the sediment is enriched with met-SWNTs and, conversely,
that the sc-SWNT concentration in the sediment is depleted.
[0093] Raman studies using a 633 nm laser source provided further evidence
for selectively dispersing semi-conducting SWNTs. FIG. 6 depicts the
radial breathing mode (RBM) region of the spectra obtained. These
findings strongly support selective solubilization of semi-conducting
SWNTs (especially with diameters in the vicinity of 0.9 nm) and the
resulting separation into an sc-enriched soluble phase and a met-enriched
insoluble phase. Again, while not intending to be bound by theory, Table
2 is a summary and interpretation of the RBM region of the 633 nm Raman
data for polymer P3HT-SWNT dispersions solvent-cast onto quartz wafers
from CHCl.sub.3 solutions.
TABLE-US-00001
TABLE 1
RBM band SWNT Pristine P3HT-SWNT
position Diameter SWNTs dispersion Sediment Supernatant
(+/-2 cm.sup.-1) (+/-0.03 nm) intensity intensity intensity intensity
Assignment
183 1.32 m w w w sc
203 1.18 s s m-s s sc
227 1.05 w w-m w w met
246 0.96 m w-m s w-m met
261 0.90 m w-m s w-m met
[0094]
TABLE-US-00002
TABLE 2
SWNT Pristine P3HT-SWNT
RBM band diameter SWNTs dispersion Sediment Supernatant
(+/-2 cm.sup.-1) (+/-0.03 nm intensity intensity intensity intensity
Assignment
190 1.26 m, sh m, sh m, sh -- met
202 1.18 m, sh m, sh m, sh w met
212 1.12 s s s m met
218 1.09 -- -- -- m met
253 0.93 m m m s sc
w = weak;
m = medium;
s = strong;
sh = shoulder
by significantly narrower and weaker profile of the band envelope in the
1540-1600 cm.sup.-1 region (and the band's slight blue shift) resulting
from the soluble phase (trace 7D) compared to the other three traces
shown. This is consistent with the supernatant (soluble phase) having a
significantly higher relative content of sc-SWNTs than any of the other
three samples. Accordingly, the insoluble phase (trace 7C) has the
highest met:sc SWNTs ratio. This further supports the selective
solubilization of sc-SWNTs, and the resulting separation into an
sc-enriched soluble phase and a met-enriched insoluble phase.
Example 3
[0095] This Example serves to illustrate a manner in which UV/vis/NIR
spectroscopy can be used to confirm fractionation of CNTs.
[0096] In one particular embodiment, carbon nanotubes are dispersed by
attaching at least one conjugated soluble polymer such as a
polythiophene, polythiophene derivatives, a polyfluorene, or combinations
thereof to the nanotube. In a particular embodiment, the conjugated
soluble polymer is P3HT. While not intending to be bound by theory, the
enhanced solubilization of some SWNTs by non-covalently attaching P3HT to
SWNTs is shown by the UV/vis/NIR absorption spectra in FIG. 8. The
UV/vis/NIR absorption spectra in FIG. 8 shows that P3HT has an affinity
for the SWNTs, as evidenced by the 550-650 nm range (circled area FIG.
8). For comparative purposes, an UV/vis/NIR absorption spectrum of
untreated SWNTs is shown in FIG. 9
Example 4
[0097] This Example serves to illustrate how solution-based processing
techniques can be used to fabricate a TFT device comprising CNTs.
[0098] Referring to FIG. 10, the processing begins with a silicon (Si)
wafer 1001 (comprising an .about.1000 .ANG. silicon oxide layer 1008) on
which a mask is applied to pattern source and drain electrodes 1002 and
1003, respectively. SWNTs are then solution cast onto the wafer such that
they fill the channel region 1004 between the source and drain
electrodes. Then, a layer of dielectric material 1005 is deposited.
Finally, a gate material 1006 is deposited on the dielectric layer 1005
to yield a TFT device 1007.
Example 5
[0099] This Example serves to illustrate a testing device suitable for
testing and/or screening semiconducting active materials for use in TFT
devices.
[0100] Referring to FIG. 11, test device 1100 has dimensions of 1000
.mu.m.times.1000 .mu.m. The first patterned material is metal,
illustrated in black. Test device 1100 comprises a guard ring 1101, a
source electrode 1102, a drain electrode 1103, and a channel region 1104
having a channel length "L" and a channel width "W." The channel region
is the area between the source and drain electrodes. The channel length
is defined as the distance between the source and drain electrodes and
the channel width is defined as the width of the drain electrode.
Typically, in such testing devices, the channel length L ranges from
about 2 .mu.m to about 100 .mu.m, and the channel width ranges from about
10 .mu.m to about 1000 .mu.m. The square pads are probe pads 1107, with
dimensions of 1001 m.times.100 .mu.m. All metal lines are 10 .mu.m in
width. The metal can be 500 .ANG. molybdenum, platinum, or gold. Usually,
100 .ANG. of titanium is put beneath to promote adhesion. Region 1200,
identified in FIG. 11, is shown in a cross-sectional side view in FIG.
12. Referring to FIG. 12, the first patterned layer on substrate 1201
comprises source and drain electrodes 1102 and 1103, respectively, and
guard ring 1101. The second patterned layer is dielectric material 1105.
The dielectric materials can be SiO.sub.2, parylene, etc. The third
patterned layer, 1106, is the gate layer.
Example 6
[0101] This example serves to illustrate how mobility can be
increased/optimized by modulating the CNT density within the
semiconducting active material.
[0102] An intuitive way of increasing mobility within a CNT-based TFT
device is to increase the CNT density within the semiconducting active
region (i.e., the channel region). By doing this, however, the
possibility of forming continuous metallic paths that bridge the source
and drain electrodes also increases. Using multiple fractionation steps
involving P3HT suspended SWNTs, such fractionated SWNTs were incorporated
into device 1100 with a density of about 10 nanotubes per .mu.m.sup.2.
This approximate density is illustrated visually in FIG. 13, which is a
atomic force micrograph (AFM) of such nanotubes on a surface. This
density of SWNTs within device 1100 yielded a mobility of around 5
cm.sup.2/Vsec, as shown in the transfer curve of FIG. 14.
Example 7
[0103] This Example serves to illustrate a manner in which on/off ratios
can be obtained with devices in which SWNTs have been spun cast into the
channel region from a DMF suspension.
[0104] DMF-suspended SWNTs were spun cast into the channel region of
device 1100. The resulting device is shown in the scanning electron
micrographs (SEMs) of FIGS. 15 and 16, wherein FIG. 16 is a higher
magnification of a region of the area shown in FIG. 15. With such
devices, on/off ratios of 10.sup.5 and mobilities of 0.1 cm.sup.2/Vsec
were achieved, as shown in FIG. 17. It is worth noting, however, that, as
seen in the SEMs of FIGS. 15 and 16, the density of SWNTs within the
device is low.
[0105] In conclusion, the present invention provides field effect
transistors comprising carbon nanotubes made by solution based processing
techniques, wherein the carbon nanotubes within such devices have been
fractionated so as to be concentrated in semiconducting carbon nanotubes.
Additionally, the relatively low temperature solution-based processing
methods enable the use of plastics, and other temperature sensitive
materials, in the fabricated devices.
[0106] It will be understood that certain of the above-described
structures, functions, and operations of the above-described embodiments
are not necessary to practice the present invention and are included in
the description simply for completeness of an exemplary embodiment or
embodiments. In addition, it will be understood that specific structures,
functions, and operations set forth in the above-described referenced
patents and publications can be practiced in conjunction with the present
invention, but they are not essential to its practice. It is therefore to
be understood that the invention may be practiced otherwise than as
specifically described without actually departing from the spirit and
scope of the present invention as defined by the appended claims.
* * * * *