| United States Patent | 7,568,517 |
| Hwang , et al. | August 4, 2009 |
A thermal module (10) for dissipating heat from a heat-generating electronic component (20) includes a base plate (11), a heat-dissipating fan (16) mounted to one side of the base plate, at least a heat pipe (12) mounted to another side opposite to the one side of the base plate, and a fin assembly (14) mounted to an air outlet of the heat-dissipating fan. The heat pipe includes a bending portion (124). The fin assembly includes a portion (142) corresponding to the bending portion of the heat pipe. The fins of the portion of the fin assembly are arranged along an extension direction of the bending portion of the heat pipe.
| Inventors: | Hwang; Ching-Bai (Guangdong, CN), Hung; Jui-Wen (Guangdong, CN) |
| Assignee: |
Foxconn Technology Co., Ltd.
(Tu-Cheng, Taipei Hsien,
TW)
|
| Appl. No.: | 11/307,619 |
| Filed: | February 15, 2006 |
| Aug 05, 2005 [CN] | 2005 1 0036427 | |||
| Current U.S. Class: | 165/80.2 ; 165/104.21; 165/104.33; 165/122; 165/80.3; 361/700 |
| Current International Class: | F28F 7/00 (20060101) |
| Field of Search: | 165/80.1-80.3,121,122,104.21,104.33,104.26 361/695,697,699,700,709 |
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