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United States Patent	D394,080
Chan	May 5, 1998

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The ornamental design for an embossing device, as shown and described.

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Inventors:	Chan; Yip Kwong (Hong Kong, HK)
Assignee:	Y & H Industrial Limited (New Territories, HK)
Appl. No.:	D/072,132
Filed:	June 9, 1997

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Current U.S. Class:	D18/19 ; D18/14; D19/65
Current International Class:	0805
Field of Search:	D18/14,15,19 D19/65 D8/49-51 156/220,219 400/134.6,134.4 101/31.1,28,327

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References Cited

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U.S. Patent Documents

D339043	September 1993	Chi
553132	January 1896	Park
1306905	June 1919	Jackson

Primary Examiner: Zarfas; Louis S.
Assistant Examiner: Andoll; Gregory
Attorney, Agent or Firm: Leydig, Voit & Mayer, Ltd.

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Description

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FIG. 1 is a top, front end and right side perspective view of an embossing device showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is bottom plan view thereof;

FIG. 6 is a front end elevational view thereof; and,

FIG. 7 is a rear end elevational view thereof.

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